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STP75NS04Z

STMicroelectronics

STP75NS04Z by STMicroelectronics

STP75NS04Z by STMicroelectronics is a N-CHANNEL FET with 33V DS Breakdown Voltage, 320A IDM, and 0.011 ohm RDS(on). Ideal for SWITCHING applications due to its 110W Pdiss, 470mJ EAS rating, and ENHANCEMENT MODE operation. Package style: FLANGE MOUNT.

Median Price

$1.031

Lifecycle Status

EOL

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Avnet

USA . 1,700 parts In-Stock

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Nova Conductors

Japan . 32 parts In-Stock

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$1.111

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Chip Stock

USA . 5,500 parts In-Stock

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Vyrian

USA . 2,773 parts In-Stock

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Digiode

USA . 2,656 parts In-Stock

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Anansix

USA . 796 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 137 parts In-Stock

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$0.951

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$0.714

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$0.714

137

-

$0.951

$0.714

$0.714

LittleDiode

UK . 18 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1 parts In-Stock

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Ampacity Inc.

Singapore . 1,208 parts In-Stock

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$0.050

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$0.050

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IDEA Electronic Components Group

UK . 904 parts In-Stock

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$0.898

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$0.808

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904

$0.898

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$0.808

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Corohmni

South Africa . 338 parts In-Stock

1+ parts

$1.034

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$1.034

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Argo Parts USA

USA . 2,040 parts In-Stock

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$1.111

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Continental Prestige Electronics

USA . 1,186 parts In-Stock

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$1.111

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$1.089

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$1.089

Aztec Data Supply Inc.

USA . 4,219 parts In-Stock

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$1.553

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$1.553

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MKK Technologies

India . 1,368 parts In-Stock

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$1.688

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DigiPath Technology Company

USA . 1,368 parts In-Stock

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$1.688

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Microchip USA

USA . 274 parts In-Stock

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$13.780

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AZTECH Wire

Italy . 429 parts In-Stock

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$21.090

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Kepictronics

USA . 15,000 parts In-Stock

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Lixinc

USA . 13,301 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,779 parts In-Stock

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Perfect Parts

USA . 3,192 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,999 parts In-Stock

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Eastek

USA . 1,900 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$1.089

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$1.055

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$1.033

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$1.033

Corphita

USA . 482 parts In-Stock

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Parana Technologies

USA . 94 parts In-Stock

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$1.074

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Overview

Unlock the power of efficiency and reliability with the STP75NS04Z from STMicroelectronics! As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors for a variety of switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers customers unmatched performance and durability. Say goodbye to downtime and hello to seamless operations with the STP75NS04Z. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

High durability and resistance to external elements, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

Efficient for switching applications and provides low on-resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and can handle reverse current flow efficiently.

Transistor Application: SWITCHING

Designed for fast switching applications, making it suitable for power management systems.

Minimum DS Breakdown Voltage: 33 V

Provides a safety margin for voltage spikes and surges in the circuit.

Package Shape: RECTANGULAR

Space-efficient design for easier mounting and integration in electronic systems.

Terminal Form: THROUGH-HOLE

Simplifies PCB assembly and provides a secure mechanical connection.

Operating Mode: ENHANCEMENT MODE

Allows for precise control of the transistor's conductivity, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 320 A

High current-handling capability for demanding applications.

Avalanche Energy Rating (EAS): 470 mJ

Provides protection against voltage transients and enhances reliability in rugged conditions.

Maximum Drain Current (Abs) (ID): 80 A

Sufficient current-carrying capacity for various power circuit requirements.

No. of Terminals: 3

Simplified pin configuration for easy connection and installation.

Maximum Power Dissipation (Abs): 110 W

Ability to dissipate heat efficiently and handle high power loads.

Package Style (Meter): FLANGE MOUNT

Secure mounting option for stability in industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

High-performance technology for efficient power handling and low conduction losses.

Maximum Operating Temperature: 175 °C

Suitable for operation in high-temperature environments without compromising performance.

Transistor Element Material: SILICON

Reliable material with consistent performance and durability.

Terminal Finish: TIN

Corrosion-resistant finish for long-term reliability and electrical conductivity.

Maximum Drain-Source On Resistance: 0.011 ohm

Low on-resistance for efficient power conversion and minimal heat generation.

Terminal Position: SINGLE

Simplified connection for ease of integration in circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP75NS04Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

470 mJ

Minimum DS Breakdown Voltage:

33 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP75NS04Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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