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STP70NF3LL

STMicroelectronics

STP70NF3LL by STMicroelectronics

STP70NF3LL from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 70 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,106 parts In-Stock

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3,106

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Digiode

USA . 2,820 parts In-Stock

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2,820

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Anansix

USA . 150 parts In-Stock

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150

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 359 parts In-Stock

1+ parts

$1.274

100+ parts

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$1.147

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359

$1.274

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$1.147

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MKK Technologies

India . 837 parts In-Stock

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$2.396

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837

$2.396

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DigiPath Technology Company

USA . 837 parts In-Stock

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$2.396

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837

$2.396

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Corphita

USA . 1,970 parts In-Stock

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1,970

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Parana Technologies

USA . 676 parts In-Stock

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$1.524

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676

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$1.524

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Overview

Unlock unparalleled performance with the STP70NF3LL from STMicroelectronics—a leader in innovative semiconductor solutions. This robust N-channel power FET is designed for efficient switching applications, ensuring reliability and longevity in demanding environments. With its superior thermal management and built-in diode, you can trust it to handle high currents seamlessly. Elevate your projects with the quality and expertise that only STMicroelectronics can deliver, boosting your designs' efficiency and effectiveness.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental conditions, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher efficiency, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse voltage, ensuring reliability in switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, it allows for efficient control of power, leading to energy savings in electronic circuits.

Minimum DS Breakdown Voltage: 30 V

A breakdown voltage of 30V allows the FET to be used in various applications, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape can offer more efficient use of space on PCBs, making it easier to design compact electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are often easier to handle during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs allow for higher control over conductivity, improving performance in digital and analog applications.

Maximum Pulsed Drain Current (IDM): 280 A

A high maximum pulsed current capability enables the FET to handle transient conditions effectively, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 500 mJ

A high avalanche energy rating provides assurance for the device to withstand accidental high-energy events without failure.

Maximum Drain Current (Abs) (ID): 70 A

A maximum drain current of 70A allows this FET to handle substantial loads, ideal for high-power applications.

No. of Terminals: 3

Having three terminals simplifies circuit design and layout, offering flexibility in various configurations.

Maximum Power Dissipation (Abs): 100 W

With a high power dissipation capability, this FET can handle large amounts of power without overheating, ensuring reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides ease of mounting and stability in applications where physical support is crucial.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high-speed operation and low power consumption, making it suitable for digital and analog circuits.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C ensures that the FET can function effectively in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the base material is standard in FETs due to its excellent thermal and electrical properties.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces oxidation, ensuring reliable electrical connections.

Maximum Drain Current (ID): 70 A

Consistent drain current capacity reinforces its suitability for high-power applications, providing confidence in performance.

Maximum Drain-Source On Resistance: 0.0095 ohm

A low on-resistance ensures minimal power loss and heat generation when the FET is in operation, improving efficiency.

Terminal Position: SINGLE

Single terminal position simplifies the layout and contributes to compact designs in electronic circuits.

Case Connection: DRAIN

DRAIN connection configuration is standard for enhanced performance in power applications, ensuring efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) STP70NF3LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

70 A

Maximum Drain-Source On Resistance:

.0095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP70NF3LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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