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STP7NB60FP

STMicroelectronics

STP7NB60FP by STMicroelectronics

STP7NB60FP by STMicroelectronics is a N-CHANNEL FET with 600V DS Breakdown Voltage, 28.8A IDM, and 580mJ EAS. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, offering high power dissipation of 40W at max temp of 150°C.

Median Price

$1.406

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,636 parts In-Stock

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1,636

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Anansix

USA . 1,367 parts In-Stock

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Electronics Depot

USA . 600 parts In-Stock

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600

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Halfin

Belgium . 580 parts In-Stock

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580

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Sunrise Surplus Inc.

USA . 400 parts In-Stock

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400

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Digiode

USA . 359 parts In-Stock

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359

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LIBRA Elektronik GmbH

Germany . 350 parts In-Stock

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350

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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50

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Bristol Electronics

USA . 50 parts In-Stock

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$1.406

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50

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$1.406

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Holdelec - ElecDif-Pro

France . 31 parts In-Stock

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31

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LittleDiode

UK . 28 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 7 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,874 parts In-Stock

1+ parts

$0.990

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4,874

$0.990

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IDEA Electronic Components Group

UK . 583 parts In-Stock

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$1.064

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$0.958

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583

$1.064

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$0.958

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Corohmni

South Africa . 244 parts In-Stock

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$1.259

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244

$1.259

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MKK Technologies

India . 922 parts In-Stock

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$2.002

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922

$2.002

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DigiPath Technology Company

USA . 922 parts In-Stock

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$2.002

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922

$2.002

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Ampacity Inc.

Singapore . 1,139 parts In-Stock

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$6.050

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1,139

$6.050

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AZTECH Wire

Italy . 304 parts In-Stock

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$15.329

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304

$15.329

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Semicontronic

India . 768 parts In-Stock

1+ parts

$45.050

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$43.924

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$43.698

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768

$45.050

$43.924

$43.698

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Kepictronics

USA . 15,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,927 parts In-Stock

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Argo Parts USA

USA . 3,116 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,780 parts In-Stock

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Parana Technologies

USA . 1,033 parts In-Stock

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$1.273

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Perfect Parts

USA . 139 parts In-Stock

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139

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Bastille Electronics

Australia . 120 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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Glotronic Ltd.

UK . 40 parts In-Stock

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Assy Fe

Spain . 7 parts In-Stock

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor for your switching applications? Look no further than the STP7NB60FP by STMicroelectronics. With its N-CHANNEL configuration and 600V minimum DS breakdown voltage, this transistor offers excellent performance and durability. Whether you're working on industrial, automotive, or consumer electronics projects, the STP7NB60FP is the perfect choice. Trust STMicroelectronics for cutting-edge technology and unmatched value in every product they offer. Experience the difference with the STP7NB60FP today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltage applications, making it suitable for demanding switching environments.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance when turning on and off electrical circuits.

Maximum Power Dissipation (Abs): 40 W

The high power dissipation capability allows the FET to handle high power loads without overheating, ensuring stable operation.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) STP7NB60FP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

580 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

4.1 A

Maximum Drain Current (ID):

4.1 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

21 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

40 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28.8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

39 ns

Trade Compliance

STP7NB60FP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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