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STM806RM6E

STMicroelectronics

STM806RM6E by STMicroelectronics

STM806RM6E by STMicroelectronics is a compact power management IC designed for industrial applications, operating b/w -40 °C and 85 °C. It supports supply voltages from 1.1V to 5.5V with a nominal voltage of 3.6V and features an 8-terminal gull-wing package. Ideal for efficient power supply support, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,662 parts In-Stock

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3,662

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Anansix

USA . 1,028 parts In-Stock

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1,028

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Digiode

USA . 57 parts In-Stock

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57

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 728 parts In-Stock

1+ parts

$2.500

100+ parts

-

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728

$2.500

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Microchip USA

USA . 234 parts In-Stock

1+ parts

$4.605

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-

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234

$4.605

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AZTECH Wire

Italy . 947 parts In-Stock

1+ parts

$8.350

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947

$8.350

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IDEA Electronic Components Group

UK . 1,667 parts In-Stock

1+ parts

$17.949

100+ parts

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$16.154

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1,667

$17.949

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$16.154

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MKK Technologies

India . 420 parts In-Stock

1+ parts

$33.752

100+ parts

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420

$33.752

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DigiPath Technology Company

USA . 420 parts In-Stock

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$33.752

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420

$33.752

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Corphita

USA . 4,138 parts In-Stock

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4,138

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Vigor

Singapore . 2,598 parts In-Stock

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2,598

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Parana Technologies

USA . 1,541 parts In-Stock

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$21.461

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1,541

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$21.461

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Overview

Elevate your designs with the STM806RM6E from STMicroelectronics, a leader in power management solutions. This robust IC ensures reliable performance across diverse applications, from industrial controls to consumer electronics. With a compact design and exceptional temperature range, it guarantees efficiency and durability, enhancing your project's value. Trust in STMicroelectronics for superior quality and innovation that empowers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on the PCB, facilitating compact designs.

Package Shape: RECTANGULAR

Rectangular packages provide flexibility in layout and can optimize space utilization in circuit designs.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V is commonly used in portable electronics, enhancing compatibility with a range of devices.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies increases design versatility for various applications.

No. of Terminals: 8

With 8 terminals, this IC allows for easy integration into complex circuits while keeping the design manageable.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space-saving designs, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C makes this IC suitable for industrial applications where environmental conditions can be challenging.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40 °C ensures reliability in extreme conditions, making it ideal for outdoor or industrial environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures superior conductivity and corrosion resistance, enhancing the longevity of the IC.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB design and facilitate better connectivity options.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm allows for more compact designs, which is particularly useful in modern electronic applications.

Width: 3.9 mm

A width of 3.9 mm supports space-constrained designs, making it suitable for various compact devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being categorized as a power supply support circuit, it is designed specifically to enhance power management within devices.

Minimum Supply Voltage (Vsup): 1.1 V

A minimum operating voltage of 1.1 V allows for low-power applications, increasing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

Support for up to 40 seconds at peak reflow temperature ensures compatibility with most soldering processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is suitable for standard soldering techniques, ensuring reliable assembly.

Length: 4.9 mm

The compact length of 4.9 mm aids in the design of smaller devices, catering to market demands for miniaturization.

Nominal Threshold Voltage (V): +2.625V

The nominal threshold voltage of +2.625V provides a reference that can be utilized for voltage regulation applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness and reliability for use in demanding environments.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA highlights energy efficiency, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals allow for easy handling and better solder joints, enhancing the overall reliability of the connection.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is suitable for compact PCB designs while maintaining ease of assembly.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle a maximum supply voltage of 5.5 V makes this IC versatile for a variety of power supply scenarios.

Technical Specifications

Power Management ICs STM806RM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM806RM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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