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STM804TM6F

STMicroelectronics

STM804TM6F by STMicroelectronics

STM804TM6F from STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1.1V to 5.5V, with a max current of 0.06mA and supports temperatures from -40 °C to 85 °C. Its small outline package ensures efficient surface mounting in various electronic devices.

Median Price

$2.430

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,513 parts In-Stock

1+ parts

$2.430

100+ parts

$1.480

1k+ parts

$1.310

10k+ parts

$1.200

2,513

$2.430

$1.480

$1.310

$1.200

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$2.430

100+ parts

$1.479

1k+ parts

$1.307

10k+ parts

$1.225

2,500

$2.430

$1.479

$1.307

$1.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,574 parts In-Stock

1+ parts

$3.638

100+ parts

-

1k+ parts

-

10k+ parts

-

2,574

$3.638

-

-

-

Vyrian

USA . 8,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,526

-

-

-

-

Anansix

USA . 156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

156

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

$1.850

-

-

-

Corphita

USA . 382 parts In-Stock

1+ parts

$3.447

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$3.447

-

-

-

Microchip USA

USA . 3,729 parts In-Stock

1+ parts

$13.663

100+ parts

-

1k+ parts

-

10k+ parts

-

3,729

$13.663

-

-

-

IDEA Electronic Components Group

UK . 492 parts In-Stock

1+ parts

$19.105

100+ parts

-

1k+ parts

$17.194

10k+ parts

-

492

$19.105

-

$17.194

-

MKK Technologies

India . 1,726 parts In-Stock

1+ parts

$35.925

100+ parts

-

1k+ parts

-

10k+ parts

-

1,726

$35.925

-

-

-

DigiPath Technology Company

USA . 1,726 parts In-Stock

1+ parts

$35.925

100+ parts

-

1k+ parts

-

10k+ parts

-

1,726

$35.925

-

-

-

Perfect Parts

USA . 10,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,765

-

-

-

-

iodParts Technologies Inc.

India . 4,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,896

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 602 parts In-Stock

1+ parts

-

100+ parts

$22.843

1k+ parts

-

10k+ parts

-

602

-

$22.843

-

-

Overview

Unlock the power of efficiency with the STM804TM6F from STMicroelectronics, a leader in innovative semiconductor solutions. This robust Power Management IC is designed to enhance performance across diverse applications, ensuring reliability even in extreme temperatures. Its compact design and advanced features provide unmatched value, making it ideal for industrial and consumer electronics alike. Choose STM804TM6F for superior quality and a trusted partnership in powering your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers robustness and reliability, making it suitable for various operating environments.

Surface Mount: YES

Surface mount technology ensures easier and more efficient manufacturing processes, allowing for compact designs in modern applications.

Package Shape: RECTANGULAR

The rectangular shape is optimal for space-saving layouts on PCBs, enhancing design flexibility.

Nominal Supply Voltage (Vsup): 3.6 V

This particular voltage offers significant compatibility with many common electronic systems and components.

Power Supplies (V): 3.3/5

Supports multiple voltage levels, accommodating a wide range of applications and improving versatility.

No. of Terminals: 8

The 8-terminal configuration provides sufficient connectivity for various functions and signals, facilitating diverse usages.

Package Style (Meter): SMALL OUTLINE

Small outline design reduces the footprint on PCBs, ideal for compact electronics without compromising performance.

Maximum Operating Temperature: 85 °C

High thermal tolerance allows reliable operation in elevated temperature environments, enhancing product longevity.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures makes this IC suitable for industrial and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish improves solderability and ensures better electrical connections, translating to improved performance.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility and helps in optimal layout designs for signal integrity.

Maximum Seated Height: 1.75 mm

A low seated height allows the IC to fit into restricted spaces, making it suitable for compact electronic devices.

Width: 3.9 mm

Narrow width is advantageous for high-density PCB layouts, improving efficiency and space management.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, it effectively manages voltage regulation, enhancing the overall performance of electronic systems.

Minimum Supply Voltage (Vsup): 1.1 V

Low minimum supply voltage enables compatibility with battery-operated devices, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature: 40 s

Flexibility during reflow soldering allows for optimized manufacturing processes, reducing production time.

Peak Reflow Temperature: 260 °C

High peak reflow temperature capability ensures compatibility with most soldering processes, facilitating efficient assembly.

Length: 4.9 mm

Compact length supports integration into small form-factor devices, ensuring space efficiency without compromising functionality.

Nominal Threshold Voltage: +3.075V

This threshold voltage is ideal for precise voltage regulation in various circuits, ensuring reliable operation.

Temperature Grade: INDUSTRIAL

Industrial grade components ensure durability and reliability in harsh environments, making this IC a strong choice for widespread applications.

Maximum Supply Current (Isup): 0.06 mA

Low current draw is beneficial for power-sensitive applications, enhancing overall system efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides excellent soldering properties and mechanical stability, promoting reliability in connections.

Terminal Pitch: 1.27 mm

Optimal terminal pitch supports efficient PCB design layouts, allowing for dense positioning of components.

Maximum Supply Voltage (Vsup): 5.5 V

A high maximum supply voltage provides versatility for use in diverse applications where varying power supply levels are required.

Technical Specifications

Power Management ICs STM804TM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.075V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.075V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM804TM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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