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STM804RM6F

STMicroelectronics

STM804RM6F by STMicroelectronics

STM804RM6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.6V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages b/w 1.1V and 5.5V, ideal for industrial applications. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

$0.550

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.550

2,500

-

-

-

$0.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,447 parts In-Stock

1+ parts

$2.470

100+ parts

-

1k+ parts

-

10k+ parts

-

4,447

$2.470

-

-

-

Vyrian

USA . 3,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,460

-

-

-

-

Anansix

USA . 1,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,722

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,800 parts In-Stock

1+ parts

$1.560

100+ parts

-

1k+ parts

-

10k+ parts

-

4,800

$1.560

-

-

-

Corphita

USA . 3,035 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

-

10k+ parts

-

3,035

$2.340

-

-

-

Microchip USA

USA . 5,427 parts In-Stock

1+ parts

$11.895

100+ parts

-

1k+ parts

-

10k+ parts

-

5,427

$11.895

-

-

-

IDEA Electronic Components Group

UK . 1,834 parts In-Stock

1+ parts

$15.887

100+ parts

-

1k+ parts

$14.299

10k+ parts

-

1,834

$15.887

-

$14.299

-

AZTECH Wire

Italy . 409 parts In-Stock

1+ parts

$18.840

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$18.840

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$24.813

100+ parts

$22.580

1k+ parts

$20.347

10k+ parts

-

5,000

$24.813

$22.580

$20.347

-

Component Stockers USA

USA . 4,695 parts In-Stock

1+ parts

$27.290

100+ parts

-

1k+ parts

-

10k+ parts

-

4,695

$27.290

-

-

-

MKK Technologies

India . 1,584 parts In-Stock

1+ parts

$29.875

100+ parts

-

1k+ parts

-

10k+ parts

-

1,584

$29.875

-

-

-

DigiPath Technology Company

USA . 1,584 parts In-Stock

1+ parts

$29.875

100+ parts

-

1k+ parts

-

10k+ parts

-

1,584

$29.875

-

-

-

Perfect Parts

USA . 5,559 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,559

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-

-

-

Parana Technologies

USA . 982 parts In-Stock

1+ parts

-

100+ parts

$18.996

1k+ parts

-

10k+ parts

-

982

-

$18.996

-

-

Overview

Unlock the potential of your designs with the STM804RM6F from STMicroelectronics—a reliable power management IC engineered for excellence. With a robust temperature range and exceptional performance, this compact solution ensures optimal efficiency in a variety of applications, from industrial controls to consumer electronics. Trust in STMicroelectronics' legacy of quality and innovation to empower your projects with unparalleled reliability and energy savings.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making the IC reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits, facilitating efficient PCB layout.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, which is essential for compact device designs.

Nominal Supply Voltage (Vsup): 3.6 V

This nominal voltage offers balance and compatibility with various electronic systems, ensuring stable performance.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies increases versatility for various applications, making it suitable for different design requirements.

No. of Terminals: 8

Eight terminals provide sufficient connection points for a variety of circuit designs, enhancing connectivity and functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced space requirements on the PCB, supporting high-density designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the IC to function reliably in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures functionality in extreme conditions, enhancing the product's applicability in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This premium terminal finish guarantees excellent conductivity and corrosion resistance, improving long-term reliability.

Terminal Position: DUAL

Dual positional terminals facilitate easier layout design and better connection options on the PCB.

Maximum Seated Height: 1.75 mm

A low seated height is ideal for thin devices, allowing for the development of slim form-factor applications.

Width: 3.9 mm

The compact width fits well in size-constrained applications, enabling more efficient use of PCB space.

Other IC Type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, it enhances the efficiency of power distribution in electronic devices, optimizing performance.

Minimum Supply Voltage (Vsup): 1.1 V

The capability to operate at a low minimum voltage broadens the range of compatible circuits and energy-efficient designs.

Maximum Time At Peak Reflow Temperature: 40 s

A robust peak reflow time supports various soldering methods and ensures reliability during assembly processes.

Peak Reflow Temperature: 260 °C

This high peak temperature tolerance allows for assembly in harsh manufacturing environments without degradation.

Length: 4.9 mm

A short length contributes to a compact overall package, essential for miniaturized electronic devices.

Nominal Threshold Voltage: +2.625 V

This threshold ensures optimal switching performance, enhancing the reliability of power management applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates suitability for rigorous conditions, appealing to commercial and industrial markets.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current enhances energy efficiency, which is crucial for battery-powered and portable applications.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process and improve mechanical stability, promoting ease of assembly.

Terminal Pitch: 1.27 mm

The terminal pitch allows for easier mounting on PCBs while maintaining compactness, thereby supporting dense designs.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a maximum supply voltage of 5.5 V ensures compatibility with commonly used voltage levels in various applications.

Technical Specifications

Power Management ICs STM804RM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM804RM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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