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STM802SM6E

STMicroelectronics

STM802SM6E by STMicroelectronics

STM802SM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V, operating from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.1V to 5.5V, ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,630 parts In-Stock

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5,630

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Digiode

USA . 1,986 parts In-Stock

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1,986

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Anansix

USA . 1,062 parts In-Stock

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1,062

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EMSNET

USA . 90 parts In-Stock

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90

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 859 parts In-Stock

1+ parts

$2.209

100+ parts

-

1k+ parts

$1.988

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-

859

$2.209

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$1.988

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MKK Technologies

India . 990 parts In-Stock

1+ parts

$4.154

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990

$4.154

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DigiPath Technology Company

USA . 990 parts In-Stock

1+ parts

$4.154

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990

$4.154

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AZTECH Wire

Italy . 1,159 parts In-Stock

1+ parts

$16.960

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1,159

$16.960

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Microchip USA

USA . 259 parts In-Stock

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$24.468

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259

$24.468

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$25.776

100+ parts

$23.456

1k+ parts

$21.136

10k+ parts

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2,000

$25.776

$23.456

$21.136

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QUARKTWIN TECHNOLOGY LTD

USA . 10,945 parts In-Stock

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10,945

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Corphita

USA . 3,332 parts In-Stock

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3,332

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Parana Technologies

USA . 2,140 parts In-Stock

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$2.641

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2,140

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$2.641

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Vigor

Singapore . 1,217 parts In-Stock

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1,217

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Overview

Unlock the potential of your next project with the STM802SM6E from STMicroelectronics—a leader in power management solutions. This compact, robust IC guarantees reliability across diverse applications, from industrial systems to consumer electronics. With its exceptional temperature range and minimal power consumption, the STM802SM6E ensures optimal performance and efficiency. Experience peace of mind knowing you're backed by ST's legacy of innovation and quality—where every detail is designed to enhance your product’s value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a durable and lightweight package, ensuring reliability in various applications.

Surface Mount: YES

Surface mount capability allows for automated assembly and a smaller PCB footprint, making it ideal for space-constrained designs.

Package Shape: RECTANGULAR

The rectangular shape is suitable for efficient layout in circuit designs, optimizing space and improving performance.

Nominal Supply Voltage (Vsup): 3.6 V

Operating at a nominal supply voltage of 3.6 V is compatible with many common systems, providing versatility in application.

Power Supplies (V): 3.3/5

Supports multiple supply voltages (3.3V and 5V), enhancing flexibility for integration into various electronic systems.

No. of Terminals: 8

Eight terminals allow for multiple connections, enabling more complex circuit configurations and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to more compact designs without sacrificing performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C allows this IC to function effectively in extreme cold conditions, broadening its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent solderability and corrosion resistance, leading to long-lasting connections.

Terminal Position: DUAL

Dual terminal position offers versatility in circuit design, accommodating a variety of layout requirements.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm allows for a slim profile in applications, which is advantageous in compact electronic designs.

Width (mm): 3.9 mm

The width of 3.9 mm is optimized for space efficiency on circuit boards, making it a suitable choice for modern electronics.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit IC, it enhances system efficiency by regulating voltage, which is crucial for optimal device performance.

Minimum Supply Voltage (Vsup): 1.1 V

With a minimum supply voltage of 1.1 V, it provides low-power operation, making it ideal for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 40

A higher tolerance for peak reflow temperature ensures reliable soldering during production, enhancing assembly efficiency.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C accommodates modern soldering processes, ensuring compatibility with industry standards.

Length: 4.9 mm

Compact length of 4.9 mm allows for efficient use of printed circuit board real estate, fitting into tight layouts.

Nominal Threshold Voltage (V): +2.925V

The nominal threshold voltage of +2.925V contributes to precise voltage regulation, enhancing system reliability.

Temperature Grade: INDUSTRIAL

Designed for industrial grade applications, this IC offers higher performance and durability, suitable for rigorous operational environments.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of only 0.06 mA ensures low power consumption, making it highly efficient for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form allows for easy mounting and facilitates improved heat dissipation, contributing to system reliability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is conducive for compact designs while maintaining adequate spacing for soldering and connections.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of handling up to 5.5 V supply voltage provides flexibility for integration with various power systems.

Technical Specifications

Power Management ICs STM802SM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.925V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM802SM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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