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STM708TM6E

STMicroelectronics

STM708TM6E by STMicroelectronics

STM708TM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.3V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.2V to 5.5V, ideal for industrial applications. Its compact design (4.9mm x 3.9mm) ensures efficient space utilization in electronic devices.

Median Price

$28.049

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 1,000 parts In-Stock

1+ parts

$28.049

100+ parts

$25.525

1k+ parts

$23.000

10k+ parts

-

1,000

$28.049

$25.525

$23.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,601 parts In-Stock

1+ parts

$26.647

100+ parts

-

1k+ parts

-

10k+ parts

-

4,601

$26.647

-

-

-

Vyrian

USA . 7,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,884

-

-

-

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Anansix

USA . 174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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174

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 268 parts In-Stock

1+ parts

$8.702

100+ parts

-

1k+ parts

-

10k+ parts

-

268

$8.702

-

-

-

AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$21.930

100+ parts

-

1k+ parts

-

10k+ parts

-

712

$21.930

-

-

-

IDEA Electronic Components Group

UK . 2,312 parts In-Stock

1+ parts

$22.412

100+ parts

-

1k+ parts

$20.171

10k+ parts

-

2,312

$22.412

-

$20.171

-

Corphita

USA . 1,142 parts In-Stock

1+ parts

$25.244

100+ parts

-

1k+ parts

-

10k+ parts

-

1,142

$25.244

-

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$28.049

100+ parts

$25.525

1k+ parts

$23.000

10k+ parts

-

1,000

$28.049

$25.525

$23.000

-

MKK Technologies

India . 1,455 parts In-Stock

1+ parts

$42.145

100+ parts

-

1k+ parts

-

10k+ parts

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1,455

$42.145

-

-

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DigiPath Technology Company

USA . 1,455 parts In-Stock

1+ parts

$42.145

100+ parts

-

1k+ parts

-

10k+ parts

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1,455

$42.145

-

-

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Component Stockers USA

USA . 414 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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414

$99.990

-

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A-Z Elektronik GmbH

Germany . 6,998 parts In-Stock

1+ parts

-

100+ parts

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6,998

-

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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Parana Technologies

USA . 2,095 parts In-Stock

1+ parts

-

100+ parts

$26.797

1k+ parts

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10k+ parts

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2,095

-

$26.797

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,000

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Perfect Parts

USA . 560 parts In-Stock

1+ parts

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100+ parts

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560

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Overview

Elevate your projects with the STM708TM6E from STMicroelectronics, a leader in power management solutions. Designed for reliability and efficiency, this compact IC ensures optimal performance across industrial applications. With its robust temperature range and minimal power consumption, it empowers you to create innovative designs without compromise. Trust in STMicroelectronics’ quality and expertise to deliver unmatched value and enhance your product's performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material provides enhanced environmental protection and reliability for the Power Management IC.

Surface Mount: YES

Surface mount capability allows for easy integration in compact and high-density electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient space utilization on PCBs, making it versatile for various applications.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V is ideal for modern digital circuits, ensuring compatibility with a wide range of components.

Power Supplies (V): 3.3/5

Supports both 3.3 V and 5 V power supplies, providing flexibility and versatility for different system requirements.

No. of Terminals: 8

With 8 terminals, this IC offers ample connections for complex functionality while remaining easy to integrate.

Package Style (Meter): SMALL OUTLINE

The small outline package style is perfect for space-constrained applications, allowing for more compact designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C enables the IC to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C makes this IC suitable for industrial and automotive applications in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances reliability and longevity by providing excellent corrosion resistance.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility and performance by minimizing parasitic inductance.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm ensures a low profile, making it suitable for slimline devices.

Width: 3.9 mm

A width of 3.9 mm contributes to compactness, allowing for efficient layouts in limited spaces.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC ensures stable voltage regulation within the system.

Minimum Supply Voltage (Vsup): 1.2 V

Supports a wide range of supply voltages starting from 1.2 V, adding versatility for various applications.

Length: 4.9 mm

A length of 4.9 mm contributes to a compact package size, ideal for modern miniaturized electronic designs.

Nominal Threshold Voltage (V): +3.08V

A nominal threshold voltage of +3.08V optimizes performance in systems that require precise voltage thresholds.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, making it suitable for robust applications across various industries.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current of 0.06 mA enhances energy efficiency, suitable for battery-operated and low-power devices.

Terminal Form: GULL WING

Gull wing terminal form provides excellent soldering characteristics and mechanical strength for reliable connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for efficient routing on PCBs and compatibility with a range of assembly processes.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle supply voltages up to 5.5 V provides additional headroom for various electronic configurations.

Technical Specifications

Power Management ICs STM708TM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.08V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Width (mm):

3.9 mm

Trade Compliance

STM708TM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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