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STM708TDS6E

STMicroelectronics

STM708TDS6E by STMicroelectronics

STM708TDS6E by STMicroelectronics is a power management IC with a nominal voltage of 3.3V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages up to 5.5V, ideal for industrial applications. Its compact design ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,649 parts In-Stock

1+ parts

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100+ parts

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3,649

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Digiode

USA . 2,927 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,927

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Anansix

USA . 1,989 parts In-Stock

1+ parts

-

100+ parts

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1,989

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,000 parts In-Stock

1+ parts

$8.520

100+ parts

-

1k+ parts

$7.668

10k+ parts

-

2,000

$8.520

-

$7.668

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Microchip USA

USA . 133 parts In-Stock

1+ parts

$9.989

100+ parts

-

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10k+ parts

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133

$9.989

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AZTECH Wire

Italy . 1,116 parts In-Stock

1+ parts

$12.870

100+ parts

-

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10k+ parts

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1,116

$12.870

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-

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MKK Technologies

India . 1,377 parts In-Stock

1+ parts

$16.022

100+ parts

-

1k+ parts

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10k+ parts

-

1,377

$16.022

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DigiPath Technology Company

USA . 1,377 parts In-Stock

1+ parts

$16.022

100+ parts

-

1k+ parts

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10k+ parts

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1,377

$16.022

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Corphita

USA . 4,007 parts In-Stock

1+ parts

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4,007

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Vigor

Singapore . 2,400 parts In-Stock

1+ parts

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2,400

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Parana Technologies

USA . 1,544 parts In-Stock

1+ parts

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100+ parts

$10.187

1k+ parts

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10k+ parts

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1,544

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$10.187

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Overview

Elevate your designs with the STM708TDS6E from STMicroelectronics, a trusted leader in power management solutions. This compact and efficient IC ensures reliable performance across diverse applications, from consumer electronics to industrial automation. With its robust temperature range and low power consumption, you can achieve optimal efficiency without compromise. Count on STMicroelectronics for quality and innovation that empowers your projects—bringing you reliability and excellence in every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protects the IC from environmental factors, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier integration into modern circuit boards, making this IC ideal for space-constrained applications.

Package Shape: SQUARE

A square package shape optimizes space on the PCB while providing uniform thermal and electrical performance.

Nominal Supply Voltage (Vsup): 3.3 V

With a nominal supply voltage of 3.3V, this IC is suitable for most modern digital circuits and systems, ensuring compatibility with a wide range of devices.

Power Supplies (V): 3.3/5

The ability to support both 3.3V and 5V power supplies makes this IC versatile for various applications.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, enhancing the functionality of the IC within a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design facilitate high-density PCB designs, making it suitable for portable and compact electronics.

Maximum Operating Temperature: 85 °C

An operational range up to 85 °C ensures reliability in various industrial environments.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C makes this IC ideal for harsh conditions, enabling usage in wide-ranging industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish of nickel-palladium-gold enhances solderability and ensures excellent long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on PCB, contributing to design efficiency.

Maximum Seated Height: 1.1 mm

A low seated height supports low-profile applications, making it beneficial for compact device designs.

Width (mm): 3 mm

A compact width of 3 mm allows for efficient use of PCB space without compromising performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit means it is specifically designed for voltage regulation, enhancing overall circuit performance.

Minimum Supply Voltage (Vsup): 1.2 V

A minimum supply voltage of 1.2V provides flexibility for low-power applications, making it suitable for battery-powered devices.

Length: 3 mm

A compact length of 3 mm complements its width, ensuring a sleek profile for denser component placement.

Nominal Threshold Voltage (V): +3.08V

A nominal threshold voltage of +3.08V enhances precision in power supply applications, ensuring reliable operation.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robust performance under various conditions, making it reliable for long-term operation.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA contributes to energy efficiency, vital for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering during assembly, ensuring reliable connections.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm balances space efficiency and manufacturability, ideal for automated assembly processes.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle up to 5.5V allows this IC to be used in applications requiring higher voltage levels without damage.

Technical Specifications

Power Management ICs STM708TDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.08V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Width (mm):

3 mm

Trade Compliance

STM708TDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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