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STM708SDS6E

STMicroelectronics

STM708SDS6E by STMicroelectronics

STM708SDS6E from STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V and operates in extreme temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages up to 5.5V. Ideal for industrial applications, it ensures reliable power supply management in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,003 parts In-Stock

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Anansix

USA . 1,594 parts In-Stock

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1,594

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Digiode

USA . 1,447 parts In-Stock

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1,447

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IDEA Electronic Components Group

UK . 456 parts In-Stock

1+ parts

$17.144

100+ parts

-

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$15.430

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456

$17.144

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$15.430

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AZTECH Wire

Italy . 574 parts In-Stock

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$17.920

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574

$17.920

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Advanced Electronics

New Zealand . 85 parts In-Stock

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$28.532

100+ parts

$25.964

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$23.396

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85

$28.532

$25.964

$23.396

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MKK Technologies

India . 1,276 parts In-Stock

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$32.239

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1,276

$32.239

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DigiPath Technology Company

USA . 1,276 parts In-Stock

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$32.239

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$32.239

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QUARKTWIN TECHNOLOGY LTD

USA . 28,398 parts In-Stock

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Vigor

Singapore . 5,000 parts In-Stock

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Microchip USA

USA . 3,673 parts In-Stock

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Corphita

USA . 1,327 parts In-Stock

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1,327

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Parana Technologies

USA . 1,205 parts In-Stock

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$20.498

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$20.498

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Overview

Unlock the power of efficiency with the STM708SDS6E from STMicroelectronics, a leader in high-quality power management solutions. Designed for reliability across demanding applications, this compact IC excels in optimizing performance while minimizing energy consumption. Its robust design withstands extreme temperatures, ensuring resilience in industrial environments. Elevate your projects with unmatched quality and enjoy seamless integration, making it the perfect choice for modern electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy construction ensures a lightweight yet durable package, suitable for various applications.

Surface Mount: YES

Surface mount design allows for automated assembly and compact circuit designs, optimizing board space.

Package Shape: SQUARE

Square package shape facilitates efficient layout and symmetrical alignment on PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V makes this IC compatible with many modern digital systems.

Power Supplies (V): 3.3/5

Dual supply voltage compatibility (3.3V and 5V) provides flexibility in system design.

No. of Terminals: 8

Eight terminals provide multiple connection options, allowing for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and small outline design enable high-density mounting on PCBs, ideal for compact electronics.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC ensures reliable performance in moderate thermal conditions.

Minimum Operating Temperature: -40 °C

Suitable for industrial applications, the IC operates effectively in extremely low temperatures, enhancing reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and reliable solderability for enhanced performance.

Terminal Position: DUAL

Dual terminal positions simplify routing in complex layouts, facilitating easier integration.

Maximum Seated Height: 1.1 mm

Low seated height ensures compatibility with thin devices and helps maintain design aesthetics.

Width: 3 mm

Compact width allows for space-efficient designs while maintaining performance integrity.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support IC, it effectively manages and regulates voltage, enhancing system efficiency.

Minimum Supply Voltage (Vsup): 1.2 V

The low minimum supply voltage expands usability in low-power applications, increasing design flexibility.

Length: 3 mm

Compact length aids in the overall miniaturization of electronic assemblies.

Nominal Threshold Voltage (V): +2.93V

The nominal threshold voltage of +2.93V ensures reliable operation in voltage-sensitive applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and stability in harsh environmental conditions.

Maximum Supply Current (Isup): 0.06 mA

A very low maximum supply current signifies energy-efficient performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and reliable mechanical connections, enhancing robustness.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for fine pitch layout designs, supporting higher component densities.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply designs.

Technical Specifications

Power Management ICs STM708SDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Width (mm):

3 mm

Trade Compliance

STM708SDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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