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STM708RM6E

STMicroelectronics

STM708RM6E by STMicroelectronics

STM708RM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3V, operating b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.2V to 5.5V, ideal for industrial applications. Its compact design ensures efficient space utilization in electronic circuits.

Median Price

$9.727

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 50 parts In-Stock

1+ parts

$9.727

100+ parts

$8.852

1k+ parts

$7.976

10k+ parts

-

50

$9.727

$8.852

$7.976

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,688 parts In-Stock

1+ parts

$9.241

100+ parts

-

1k+ parts

-

10k+ parts

-

2,688

$9.241

-

-

-

Vyrian

USA . 3,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,407

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-

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Anansix

USA . 1,778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,778

-

-

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ComSIT Distribution GmbH

Germany . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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900

-

-

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-

Zilex Electronics Inc.

Canada . 65 parts In-Stock

1+ parts

-

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-

1k+ parts

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65

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 363 parts In-Stock

1+ parts

$5.943

100+ parts

-

1k+ parts

-

10k+ parts

-

363

$5.943

-

-

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Corphita

USA . 3,420 parts In-Stock

1+ parts

$8.754

100+ parts

-

1k+ parts

-

10k+ parts

-

3,420

$8.754

-

-

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$9.727

100+ parts

$8.852

1k+ parts

$7.976

10k+ parts

-

50

$9.727

$8.852

$7.976

-

IDEA Electronic Components Group

UK . 17 parts In-Stock

1+ parts

$16.402

100+ parts

-

1k+ parts

$14.762

10k+ parts

-

17

$16.402

-

$14.762

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AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$18.300

100+ parts

-

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509

$18.300

-

-

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MKK Technologies

India . 1,837 parts In-Stock

1+ parts

$30.842

100+ parts

-

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10k+ parts

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1,837

$30.842

-

-

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DigiPath Technology Company

USA . 1,837 parts In-Stock

1+ parts

$30.842

100+ parts

-

1k+ parts

-

10k+ parts

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1,837

$30.842

-

-

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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8,000

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

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2,500

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Perfect Parts

USA . 1,053 parts In-Stock

1+ parts

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1,053

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Parana Technologies

USA . 627 parts In-Stock

1+ parts

-

100+ parts

$19.611

1k+ parts

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627

-

$19.611

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Cyclops Electronics Ltd (Excess)

UK . 470 parts In-Stock

1+ parts

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100+ parts

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470

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Overview

Unlock the potential of your designs with the STM708RM6E from STMicroelectronics, a trusted leader in power management solutions. Engineered for high reliability, this compact IC delivers exceptional performance across a range of applications—ensuring your systems run efficiently in even the toughest environments. With its robust temperature tolerance and versatile supply options, the STM708RM6E is your go-to choice for innovative projects that demand quality and precision. Elevate your product's efficiency and reliability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures long-lasting performance and protection against environmental factors.

Surface Mount: YES

Surface mounting allows for compact designs and efficient manufacturing processes, making it suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating easier layout and better thermal performance.

Nominal Supply Voltage (Vsup): 3 V

Ideal for low-power applications, this nominal supply voltage helps in reducing overall power consumption.

Power Supplies (V): 3/5

Supports versatile power supply options, making it flexible for various applications.

No. of Terminals: 8

With 8 terminals, it offers sufficient connectivity for integrated circuits while maintaining a compact package.

Package Style (Meter): SMALL OUTLINE

The small outline package style is optimal for space-constrained applications, allowing for higher-density designs.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures makes this IC suitable for industrial applications that encounter heat.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold, this product is ideal for outdoor and rugged applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures excellent corrosion resistance and solderability, enhancing reliability.

Terminal Position: DUAL

Dual terminal positions allow for flexible layout options in PCB design, ensuring compatibility with various designs.

Maximum Seated Height: 1.75 mm

A low seated height is beneficial for slim design preferences, contributing to the compactness of electronic devices.

Width: 3.9 mm

A narrow width aids in saving space on the PCB while allowing for more components in tighter areas.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power management, ensuring efficient power distribution and regulation within circuits.

Minimum Supply Voltage (Vsup): 1.2 V

This low minimum supply voltage is advantageous for battery-powered devices, maximizing energy efficiency.

Length: 4.9 mm

A short length helps maintain an overall compact design, suitable for devices with space constraints.

Nominal Threshold Voltage (V): +2.63V

A specific threshold voltage aids in precise control of power dynamics, enhancing the performance of regulated supplies.

Temperature Grade: INDUSTRIAL

Rated for industrial applications, ensuring reliability and performance in challenging environments.

Maximum Supply Current (Isup): 0.06 mA

Very low supply current is ideal for energy-sensitive applications, contributing to overall system efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides reliable mechanical strength and ease of soldering, improving assembly process efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with a wide range of PCB designs and assembly processes.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a broad range of supply voltages, enhancing its usability across different applications and devices.

Technical Specifications

Power Management ICs STM708RM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Width (mm):

3.9 mm

Trade Compliance

STM708RM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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