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STM708DS6F

STMicroelectronics

STM708DS6F by STMicroelectronics

STM708DS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 5V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,822 parts In-Stock

1+ parts

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7,822

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Digiode

USA . 2,269 parts In-Stock

1+ parts

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2,269

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Anansix

USA . 2,256 parts In-Stock

1+ parts

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2,256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 393 parts In-Stock

1+ parts

$1.743

100+ parts

-

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-

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393

$1.743

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IDEA Electronic Components Group

UK . 1,779 parts In-Stock

1+ parts

$10.146

100+ parts

-

1k+ parts

$9.131

10k+ parts

-

1,779

$10.146

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$9.131

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AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$13.070

100+ parts

-

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448

$13.070

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MKK Technologies

India . 2,309 parts In-Stock

1+ parts

$19.078

100+ parts

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10k+ parts

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2,309

$19.078

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DigiPath Technology Company

USA . 2,309 parts In-Stock

1+ parts

$19.078

100+ parts

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10k+ parts

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2,309

$19.078

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Corphita

USA . 3,356 parts In-Stock

1+ parts

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3,356

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,082 parts In-Stock

1+ parts

-

100+ parts

$12.131

1k+ parts

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1,082

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$12.131

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Overview

Elevate your design with the STM708DS6F from STMicroelectronics, a leader in innovative power management solutions. This compact IC ensures reliable performance across diverse applications, from industrial automation to consumer electronics. With superior thermal stability and low power consumption, it offers exceptional efficiency and longevity. Trust in STMicroelectronics' reputation for quality and innovation to maximize value and reliability in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection from environmental factors, making the IC suitable for a variety of applications.

Surface Mount: YES

Surface mounting simplifies the manufacturing process and allows for higher-density circuit designs.

Package Shape: SQUARE

The square shape optimizes space on the PCB, making it easier to integrate into compact designs.

Nominal Supply Voltage (Vsup): 5 V

A standard nominal supply voltage of 5V ensures compatibility with many power supply systems, increasing versatility.

Power Supplies (V): 1.5/5

Supporting a range of 1.5 to 5V makes it adaptable to different voltage requirements in various applications.

No. of Terminals: 8

The 8-terminal configuration allows for sufficient functionality while still being compact and manageable.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style enhances the product's suitability for space-constrained applications, facilitating better layout and integration.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures reliability in industrial environments where heat can be a critical factor.

Minimum Operating Temperature: -40 °C

With a minimum temperature rating of -40 °C, this IC can operate in extreme conditions, making it ideal for rugged applications.

Terminal Finish: NICKEL PALLADIUM GOLD

A high-quality terminal finish ensures excellent solderability and corrosion resistance, prolonging product life.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on PCBs, aiding in design versatility.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a slim profile, ideal for designs where height is a constraint.

Width (mm): 3 mm

At just 3 mm wide, the IC's compact dimensions facilitate efficient use of limited PCB space.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC can significantly enhance the efficiency of power management systems.

Minimum Supply Voltage (Vsup): 1.2 V

With a minimum supply voltage of 1.2V, it can operate effectively in low-power applications, enhancing its usability.

Length: 3 mm

The 3 mm length allows for compact configurations, making it easier to fit into tight spaces.

Nominal Threshold Voltage (V): +4.38V

A precise nominal threshold voltage enhances performance by ensuring accurate power management and regulation.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates that this IC is built to withstand demanding conditions, making it reliable for industrial applications.

Maximum Supply Current (Isup): 0.06 mA

The low maximum supply current of 0.06 mA contributes to high energy efficiency, which is essential for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and soldering characteristics, leading to reliable connections.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm caters to modern compact designs, promoting easy integration into smaller PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a safe margin for voltage fluctuations, ensuring the IC operates reliably within specified limits.

Technical Specifications

Power Management ICs STM708DS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

THRESHOLD VOLTAGE IS 4.38V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Width (mm):

3 mm

Trade Compliance

STM708DS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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