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STM706TM6E

STMicroelectronics

STM706TM6E by STMicroelectronics

STM706TM6E from STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V and operates in industrial temperature ranges (-40 °C to 85 °C). It features an 8-terminal gull-wing package and supports supply voltages from 1.2V to 5.5V, ideal for various applications. Its low max supply current of just 0.06mA enhances energy efficiency in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,850 parts In-Stock

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6,850

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ComSIT Distribution GmbH

Germany . 2,600 parts In-Stock

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2,600

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Anansix

USA . 2,390 parts In-Stock

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2,390

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Digiode

USA . 2,026 parts In-Stock

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2,026

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LIBRA Elektronik GmbH

Germany . 1,494 parts In-Stock

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1,494

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ACDS - Activité Composants Distribution Service

France . 140 parts In-Stock

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140

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Zilex Electronics Inc.

Canada . 93 parts In-Stock

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93

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Distributors (Availability)

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Microchip USA

USA . 367 parts In-Stock

1+ parts

$6.879

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367

$6.879

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IDEA Electronic Components Group

UK . 1,312 parts In-Stock

1+ parts

$11.039

100+ parts

-

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$9.935

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1,312

$11.039

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$9.935

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AZTECH Wire

Italy . 772 parts In-Stock

1+ parts

$13.550

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772

$13.550

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MKK Technologies

India . 975 parts In-Stock

1+ parts

$20.758

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975

$20.758

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DigiPath Technology Company

USA . 975 parts In-Stock

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$20.758

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975

$20.758

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 5,223 parts In-Stock

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5,223

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Vigor

Singapore . 5,144 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 3,353 parts In-Stock

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3,353

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Parana Technologies

USA . 2,249 parts In-Stock

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$13.199

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2,249

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$13.199

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Perfect Parts

USA . 314 parts In-Stock

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314

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Cyclops Electronics Ltd (Excess)

UK . 140 parts In-Stock

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140

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Glotronic Ltd.

UK . 112 parts In-Stock

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112

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Overview

Elevate your power management solutions with the STM706TM6E from STMicroelectronics, a trusted name in semiconductor innovation. This compact and reliable IC ensures peak performance across diverse applications, including industrial automation and consumer electronics. With its impressive temperature tolerance and energy efficiency, you can count on reduced operational costs and enhanced system reliability. Choose STM706TM6E to unlock superior quality and peace of mind in your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy minimizes the overall weight and cost of the IC while providing good moisture resistance.

Surface Mount: YES

Surface mount capability allows for efficient, space-saving designs and simplifies production processes.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for layout and routing in compact PCB designs.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V is widely used in digital circuits, making this IC versatile for various applications.

Power Supplies (V): 3.3/5

The ability to operate at both 3.3V and 5V makes this IC suitable for a variety of systems and backward compatibility.

No. of Terminals: 8

With 8 terminals, the IC provides essential functionality while maintaining simplicity and ease of integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables efficient use of space on the PCB, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in a wide range of environmental conditions, suited for industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows this IC to function in extreme cold conditions, ideal for harsh applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish enhances the solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position enhances flexibility for PCB layout designs, promoting efficient routing and placement.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm helps in reducing the overall profile of the device, accommodating space-constrained designs.

Width: 3.9 mm

A compact width of 3.9 mm allows for denser layouts, making it ideal for small form-factor devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This IC is specifically designed for power supply management, emphasizing its essential role in efficient power distribution.

Minimum Supply Voltage (Vsup): 1.2 V

A minimum supply voltage of 1.2 V enables compatibility with low-voltage systems, making it suitable for modern energy-efficient applications.

Length: 4.9 mm

A total length of 4.9 mm contributes to a compact design, allowing for effective integration into smaller devices.

Nominal Threshold Voltage (V): +3.08V

The nominal threshold voltage of +3.08V offers precise control for various power management tasks, ensuring stable operation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures suitability for a variety of challenging environments, ensuring reliability in critical applications.

Maximum Supply Current (Isup): 0.06 mA

With a maximum supply current of only 0.06 mA, this IC is energy-efficient, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent physical stability and are easier to solder, enhancing overall assembly quality.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compact design and ease of handling during manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to support a maximum supply voltage of 5.5 V increases the range of system compatibility, accommodating various electronics.

Technical Specifications

Power Management ICs STM706TM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.08V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Width (mm):

3.9 mm

Trade Compliance

STM706TM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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