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UC3906DW

Texas Instruments

UC3906DW by Texas Instruments

UC3906DW by Texas Instruments is a Power Management IC with 16 terminals, operating b/w -20 to 70°C. It supports supply voltages from 5V to 40V and features a small outline package for power supply applications. The IC has a rectangular shape, measures 10.3mm in length, and is suitable for surface mount assembly with a max reflow temperature of 260°C.

Median Price

$10.254

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

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Chip1Stop

Japan . 1 parts In-Stock

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Mouser Electronics

USA . 3,073 parts In-Stock

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$10.270

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DigiKey

USA . 2,868 parts In-Stock

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RS (Exports)

UK . 363 parts In-Stock

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Arrow

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Rochester

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Digiode

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Nova Conductors

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Chip Stock

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J & M Industries LLC

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Global Solutions Electronics Company

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LWI Electronics Inc

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Goldney Electronics S.L.

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Bristol Electronics

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Mil-Aero Solutions, Inc.

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Zilex Electronics Inc.

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ABC Electronics Ltd.

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Corel Iberica Componentes, S.L.

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Lantek

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Atlantic Semiconductor

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Inventory MP

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EMSNET

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Component Sense

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Distributors (Availability)

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Semicontronic

India . 866 parts In-Stock

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$5.210

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$5.080

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$5.054

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Corphita

USA . 1,784 parts In-Stock

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Parana Technologies

USA . 143 parts In-Stock

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$9.105

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$9.759

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Continental Prestige Electronics

USA . 6,629 parts In-Stock

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$9.215

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$9.030

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Netroflash

USA . 50 parts In-Stock

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Modulus Dynamics

Lithuania . 4,476 parts In-Stock

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$9.829

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$9.829

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Corohmni

South Africa . 64 parts In-Stock

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DigiPath Technology Company

USA . 1,973 parts In-Stock

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$10.025

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$9.223

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ChromeModa Solutions

Germany . 2,487 parts In-Stock

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$10.230

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$8.389

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IDEA Electronic Components Group

UK . 921 parts In-Stock

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$9.718

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$9.207

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$16.554

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$15.064

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Microchip USA

USA . 2,595 parts In-Stock

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$36.740

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$36.210

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$35.950

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$35.690

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$35.690

A-Z Elektronik GmbH

Germany . 10,013 parts In-Stock

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Kepictronics

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Lixinc

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Perfect Parts

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Authorized Procurement Solutions

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Argo Parts USA

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Speed Components Ltd (Excess)

Israel . 344 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Computer Components Inc. - USA

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Overview

Enhance your power management system with the Texas Instruments UC3906DW. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability for a wide range of applications. Unleash the full potential of your devices with this innovative solution that delivers optimal performance and efficiency. Experience seamless operation and enhanced functionality with the UC3906DW, a game-changer in the world of power management ICs. Upgrade your systems today and witness the difference that Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the integrated circuits inside.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Nominal Supply Voltage (Vsup): 10 V

Suitable for applications that require a stable 10V power supply.

No. of Terminals: 16

Sufficient number of terminals for connectivity and functionality of the power management IC.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: -20 °C

Wide temperature range allows for operation in colder environments as well.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides good conductivity and corrosion resistance for the terminals.

Width (mm): 7.5 mm

Compact width for space-saving design and integration into various electronic devices.

Minimum Supply Voltage (Vsup): 5 V

Supports a minimum supply voltage of 5V, suitable for low power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient assembly and soldering processes during production.

Temperature Grade: COMMERCIAL

Suitable for commercial-grade applications with moderate temperature requirements.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level ensures reliability in various environmental conditions.

Maximum Supply Voltage (Vsup): 40 V

Supports a maximum supply voltage of 40V for applications requiring higher power input.

Technical Specifications

Power Management ICs UC3906DW attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

UC3906DW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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