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UC3903L

Texas Instruments

UC3903L by Texas Instruments

UC3903L by Texas Instruments is a Power Management IC with 20 terminals, operating voltage range of 8-40V. It has a ceramic package, quad terminal position, and supports up to 4 channels. Ideal for power supply support circuits in commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,892 parts In-Stock

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Digiode

USA . 1,398 parts In-Stock

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1,398

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Semicontronic

India . 1,204 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

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$1.455

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1,204

$1.500

$1.462

$1.455

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Parana Technologies

USA . 326 parts In-Stock

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$2.931

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$3.431

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326

$2.931

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$3.431

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ChromeModa Solutions

Germany . 5,008 parts In-Stock

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$3.293

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$2.700

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5,008

$3.293

$2.700

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IDEA Electronic Components Group

UK . 2,136 parts In-Stock

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$3.293

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$2.964

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2,136

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$2.964

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One Stop Electronics

USA . 245 parts In-Stock

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$5.500

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245

$5.500

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AZTECH Wire

Italy . 549 parts In-Stock

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$12.975

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549

$12.975

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Corphita

USA . 2,235 parts In-Stock

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DigiPath Technology Company

USA . 879 parts In-Stock

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$2.969

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879

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$2.969

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Corohmni

South Africa . 215 parts In-Stock

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Overview

Enhance your power management capabilities with the Texas Instruments UC3903L, a top-of-the-line Power Management IC designed for efficiency and reliability. Manufactured by Texas Instruments, a trusted name in the industry, this chip carrier package offers superior performance and durability. Ideal for a wide range of applications, this Power Supply Support Circuit provides customers with a reliable solution for their power management needs. Experience the quality, value, and benefits that the UC3903L has to offer, and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures high durability and reliability for the power management IC.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15V is suitable for various power supply applications, providing a wide range of voltage support.

No. of Terminals: 20

Having 20 terminals allows for a greater level of connectivity and functionality in the power management IC.

Maximum Operating Temperature: 70 °C

The ability to operate at a maximum temperature of 70°C ensures stable performance even under high temperature conditions.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compact size and efficient heat dissipation, making it suitable for various space-constrained applications.

Minimum Supply Voltage (Vsup): 8 V

With a minimum supply voltage of 8V, the power management IC can operate efficiently even under low voltage conditions.

Temperature Grade: COMMERCIAL

Being commercial grade ensures that the power management IC meets industry standards for quality and reliability in commercial applications.

No. of Channels: 4

Having 4 channels allows the power management IC to control and manage multiple power sources or outputs simultaneously.

Maximum Supply Voltage (Vsup): 40 V

The maximum supply voltage of 40V provides flexibility in handling higher voltage levels in power supply systems.

Technical Specifications

Power Management ICs UC3903L attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

8.89 mm

Trade Compliance

UC3903L Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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