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UC3906DWG4

Texas Instruments

UC3906DWG4 by Texas Instruments

UC3906DWG4 by Texas Instruments is a Power Management IC with 16 terminals, Vsup range of 5-40V, and operating temp from -20 to 70°C. It is used in power supply support circuits due to its small outline package and dual terminal position.

Median Price

$18.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,120 parts In-Stock

1+ parts

$18.540

100+ parts

$11.110

1k+ parts

$10.250

10k+ parts

-

2,120

$18.540

$11.110

$10.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$10.610

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$10.610

-

-

-

Digiode

USA . 1,523 parts In-Stock

1+ parts

$12.464

100+ parts

-

1k+ parts

-

10k+ parts

-

1,523

$12.464

-

-

-

Chip Stock

USA . 37,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37,170

-

-

-

-

Vyrian

USA . 1,730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,730

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 510 parts In-Stock

1+ parts

$4.969

100+ parts

-

1k+ parts

$5.512

10k+ parts

-

510

$4.969

-

$5.512

-

DigiPath Technology Company

USA . 1,933 parts In-Stock

1+ parts

$5.471

100+ parts

$5.034

1k+ parts

-

10k+ parts

-

1,933

$5.471

$5.034

-

-

ChromeModa Solutions

Germany . 1,190 parts In-Stock

1+ parts

$5.583

100+ parts

$4.578

1k+ parts

-

10k+ parts

-

1,190

$5.583

$4.578

-

-

IDEA Electronic Components Group

UK . 998 parts In-Stock

1+ parts

$5.583

100+ parts

-

1k+ parts

$5.025

10k+ parts

-

998

$5.583

-

$5.025

-

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$9.116

100+ parts

$8.296

1k+ parts

$7.475

10k+ parts

-

150

$9.116

$8.296

$7.475

-

Continental Prestige Electronics

USA . 6,186 parts In-Stock

1+ parts

$10.610

100+ parts

-

1k+ parts

-

10k+ parts

$10.398

6,186

$10.610

-

-

$10.398

Bastille Electronics

Australia . 56 parts In-Stock

1+ parts

$10.610

100+ parts

$10.080

1k+ parts

-

10k+ parts

$9.443

56

$10.610

$10.080

-

$9.443

Corphita

USA . 1,670 parts In-Stock

1+ parts

$11.808

100+ parts

-

1k+ parts

-

10k+ parts

-

1,670

$11.808

-

-

-

Corohmni

South Africa . 1,102 parts In-Stock

1+ parts

$11.932

100+ parts

-

1k+ parts

-

10k+ parts

-

1,102

$11.932

-

-

-

Ampacity Inc.

Singapore . 2,050 parts In-Stock

1+ parts

$14.590

100+ parts

-

1k+ parts

-

10k+ parts

-

2,050

$14.590

-

-

-

Semicontronic

India . 1,756 parts In-Stock

1+ parts

$14.590

100+ parts

$14.225

1k+ parts

$14.152

10k+ parts

-

1,756

$14.590

$14.225

$14.152

-

Microchip USA

USA . 4,866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,866

-

-

-

-

Argo Parts USA

USA . 901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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901

-

-

-

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Perfect Parts

USA . 616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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616

-

-

-

-

Overview

Enhance your power management capabilities with the UC3906DWG4 by Texas Instruments, a top-tier manufacturer known for delivering quality and reliability. This innovative Power Management IC is designed for a wide range of applications, offering unparalleled efficiency and performance. With its small outline package and dual terminal position, this product provides exceptional value and convenience to customers looking for seamless power supply support. Experience the advantages of Texas Instruments technology with the UC3906DWG4 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage (Vsup): 10 V

Operating at a nominal supply voltage of 10V provides stable and consistent power output.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact designs in electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperature environments.

Minimum Operating Temperature: -20 °C

The product can also operate in low temperature conditions down to -20°C.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, Palladium, Gold terminal finish provides good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position layout allows for flexible and easy connection to other components.

Width (mm): 7.5 mm

Narrow width of 7.5mm saves space on circuit boards and makes the product suitable for compact designs.

Minimum Supply Voltage (Vsup): 5 V

Lower minimum supply voltage of 5V ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Product can withstand peak reflow temperatures for up to 30 seconds during assembly.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates the product is resistant to moisture damage during storage and handling.

Maximum Supply Voltage (Vsup): 40 V

High maximum supply voltage of 40V allows for compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs UC3906DWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

UC3906DWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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