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UC3906NG4

Texas Instruments

UC3906NG4 by Texas Instruments

UC3906NG4 by Texas Instruments is a Power Management IC with 16 terminals, operating voltage range of 5-40V. It has a rectangular package style, suitable for power supply support circuits in commercial temperature grade applications. Package dimensions are 19.305mm x 7.62mm x 5.08mm (LxWxH).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,178 parts In-Stock

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Digiode

USA . 169 parts In-Stock

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169

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Semicontronic

India . 1,562 parts In-Stock

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$0.500

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$0.488

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$0.485

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Ampacity Inc.

Singapore . 1,243 parts In-Stock

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$5.500

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One Stop Electronics

USA . 1,167 parts In-Stock

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AZTECH Wire

Italy . 550 parts In-Stock

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$6.765

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$6.765

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Parana Technologies

USA . 772 parts In-Stock

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$13.439

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$1,248.015

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$12.095

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772

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DigiPath Technology Company

USA . 1,247 parts In-Stock

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$14.798

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ChromeModa Solutions

Germany . 4,422 parts In-Stock

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$15.100

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$12.382

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IDEA Electronic Components Group

UK . 1,635 parts In-Stock

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$14.345

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$13.590

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Corohmni

South Africa . 335 parts In-Stock

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Continental Prestige Electronics

USA . 6,247 parts In-Stock

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Argo Parts USA

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Microchip USA

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Corphita

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Perfect Parts

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Bastille Electronics

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Overview

Looking for a reliable power management solution? Look no further than the UC3906NG4 by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers top-notch Power Management ICs that are perfect for a wide range of applications. With a package style that is both practical and durable, this IC offers unmatched performance and efficiency. Trust in Texas Instruments to provide you with the best-in-class solutions that will meet all your power management needs. Choose the UC3906NG4 for superior quality and reliability like no other.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easier to handle and reducing manufacturing costs.

Nominal Supply Voltage (Vsup): 10 V

This voltage is suitable for a wide range of applications, providing flexibility and compatibility with various devices.

No. of Terminals: 16

Having a high number of terminals allows for more connections and functionality, making the product versatile and adaptable to different circuits.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and continue to function optimally.

Width (mm): 7.62 mm

The compact width of the product saves space on the circuit board and allows for more efficient placement of components.

Minimum Supply Voltage (Vsup): 5 V

The ability to operate at low supply voltages enables energy-efficient performance and compatibility with a wider range of devices.

Length: 19.305 mm

The length of the product provides ample space for components and connections, ensuring proper functionality and ease of integration.

Maximum Supply Voltage (Vsup): 40 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, increasing the product's versatility and usability.

Technical Specifications

Power Management ICs UC3906NG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC3906NG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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