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UC3903NG4

Texas Instruments

UC3903NG4 by Texas Instruments

UC3903NG4 by Texas Instruments is a Power Management IC with 18 terminals, operating voltage range of 8-40V. It features adjustable threshold, suitable for power supply support circuits in commercial-grade applications. Package style is in-line rectangular shape made of plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,633 parts In-Stock

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Digiode

USA . 1,218 parts In-Stock

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One Stop Electronics

USA . 1,359 parts In-Stock

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$0.500

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1,359

$0.500

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Semicontronic

India . 581 parts In-Stock

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$1.500

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$1.462

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$1.455

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581

$1.500

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$1.455

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AZTECH Wire

Italy . 856 parts In-Stock

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$5.619

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856

$5.619

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Ampacity Inc.

Singapore . 860 parts In-Stock

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$6.500

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860

$6.500

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Parana Technologies

USA . 15 parts In-Stock

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$13.818

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$14.303

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15

$13.818

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DigiPath Technology Company

USA . 2,136 parts In-Stock

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$15.215

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$13.998

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$15.215

$13.998

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ChromeModa Solutions

Germany . 3,151 parts In-Stock

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$15.526

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$12.731

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$15.526

$12.731

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IDEA Electronic Components Group

UK . 1,383 parts In-Stock

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$15.526

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$14.750

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$13.973

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1,383

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$13.973

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Corphita

USA . 4,625 parts In-Stock

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Perfect Parts

USA . 874 parts In-Stock

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Microchip USA

USA . 388 parts In-Stock

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Corohmni

South Africa . 143 parts In-Stock

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Overview

Unlock the full potential of your power management systems with the UC3903NG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled reliability and efficiency. Whether you're looking to optimize voltage regulation or enhance power supply support circuits, this versatile device has got you covered. With a compact design and adjustable threshold feature, the UC3903NG4 provides maximum flexibility for a wide range of applications. Trust in Texas Instruments' reputation for quality and innovation, and experience the superior performance that sets this product apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power Management IC, ensuring long-term reliability.

Nominal Supply Voltage (Vsup): 15 V

Suitable for a wide range of applications that require a stable supply voltage of 15V.

No. of Terminals: 18

Sufficient number of terminals for connecting various external components and peripherals.

Maximum Operating Temperature: 70 °C

Can operate efficiently in high-temperature environments without overheating.

Technology: BIPOLAR

Uses bipolar technology for reliable performance and efficient power management.

Maximum Supply Voltage (Vsup): 40 V

Supports a maximum supply voltage of 40V, making it suitable for a wide range of power requirements.

Technical Specifications

Power Management ICs UC3903NG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e4

Length:

22.48 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

18 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC3903NG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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