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STM706TDS6F

STMicroelectronics

STM706TDS6F by STMicroelectronics

STM706TDS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,556 parts In-Stock

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8,556

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Anansix

USA . 2,665 parts In-Stock

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2,665

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Digiode

USA . 216 parts In-Stock

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216

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 110 parts In-Stock

1+ parts

$16.100

100+ parts

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110

$16.100

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Microchip USA

USA . 343 parts In-Stock

1+ parts

$18.506

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343

$18.506

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IDEA Electronic Components Group

UK . 2,000 parts In-Stock

1+ parts

$18.635

100+ parts

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$16.771

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2,000

$18.635

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$16.771

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MKK Technologies

India . 73 parts In-Stock

1+ parts

$35.041

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73

$35.041

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DigiPath Technology Company

USA . 73 parts In-Stock

1+ parts

$35.041

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73

$35.041

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Corphita

USA . 2,467 parts In-Stock

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2,467

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Vigor

Singapore . 2,026 parts In-Stock

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2,026

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Parana Technologies

USA . 174 parts In-Stock

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$22.280

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174

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$22.280

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Overview

Elevate your designs with the STM706TDS6F from STMicroelectronics—a beacon of quality in power management ICs. Renowned for its reliability and precision, this compact powerhouse thrives in diverse applications, from industrial to consumer electronics. Its robust performance features ensure efficiency, while the sturdy package design facilitates seamless integration. Choose STM706TDS6F and unlock enhanced energy management solutions that drive innovation and maximize value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials enhances overall durability and reliability, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability enables easier and more efficient PCB assembly, reducing overall production time and costs.

Package Shape: SQUARE

The square shape optimizes space on the PCB, allowing for higher density designs without compromising performance.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3 V nominal supply voltage is a common standard in power management, ensuring compatibility with a wide range of devices.

Power Supplies (V): 3.3/5

The flexibility to operate at both 3.3 V and 5 V provides versatility for different applications and device requirements.

No. of Terminals: 8

With 8 terminals, the IC allows for efficient connectivity and functionality without excessive footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design contribute to lightweight and compact assemblies, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C supports reliable performance in various industrial environments, ensuring longevity and stability.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature allows functionality in extreme conditions, making it suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the terminal's resistance to corrosion and promotes reliable solder connections.

Terminal Position: DUAL

Dual terminal positioning improves board layout flexibility, making it easier to integrate into various designs.

Maximum Seated Height: 1.1 mm

A compact seated height of 1.1 mm lends itself to low-profile designs, further aiding in space optimization on PCBs.

Width: 3 mm

At 3 mm wide, this IC is easy to integrate into compact assemblies without taking up excessive board space.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit means it is essential for regulating power and enhancing energy efficiency in electronic devices.

Minimum Supply Voltage (Vsup): 1.2 V

The ability to operate at a minimum supply voltage of 1.2 V adds to the product’s versatility for low-voltage applications.

Length: 3 mm

The 3 mm length facilitates space-efficient PCB layouts, making it suitable for compact electronic designs.

Nominal Threshold Voltage (V): +3.08V

A nominal threshold voltage of +3.08 V ensures stable performance and effective power management for connected devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ratings, this IC is robust enough to handle harsh environments often encountered in industrial applications.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA supports energy efficiency, reducing overall power consumption in device operation.

Terminal Form: GULL WING

Gull wing terminals ensure stable mounting on the PCB and facilitate easy soldering, contributing to reliable electrical connections.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm aids in achieving compact PCB layouts while maintaining clear and manageable soldering connections.

Maximum Supply Voltage (Vsup): 5.5 V

Having a maximum supply voltage of 5.5 V provides flexibility in use, accommodating a range of power supply scenarios.

Technical Specifications

Power Management ICs STM706TDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.08V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Width (mm):

3 mm

Trade Compliance

STM706TDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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