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STM706PM6E

STMicroelectronics

STM706PM6E by STMicroelectronics

STM706PM6E from STMicroelectronics is a versatile power management IC with a nominal voltage of 3V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages b/w 1.2V and 5.5V, ideal for industrial applications. Its compact design ensures efficient space utilization in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,628 parts In-Stock

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7,628

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ComSIT Distribution GmbH

Germany . 1,896 parts In-Stock

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1,896

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Anansix

USA . 1,105 parts In-Stock

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1,105

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Digiode

USA . 464 parts In-Stock

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464

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Distributors (Availability)

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Microchip USA

USA . 451 parts In-Stock

1+ parts

$9.989

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-

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451

$9.989

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$10.350

100+ parts

$9.419

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$8.487

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-

450

$10.350

$9.419

$8.487

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

1+ parts

$11.947

100+ parts

-

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$10.752

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2,116

$11.947

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$10.752

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AZTECH Wire

Italy . 500 parts In-Stock

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$21.210

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500

$21.210

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MKK Technologies

India . 856 parts In-Stock

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$22.466

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856

$22.466

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DigiPath Technology Company

USA . 856 parts In-Stock

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$22.466

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856

$22.466

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Vigor

Singapore . 7,343 parts In-Stock

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7,343

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,301 parts In-Stock

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3,301

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A-Z Elektronik GmbH

Germany . 2,214 parts In-Stock

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Parana Technologies

USA . 1,389 parts In-Stock

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$14.285

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1,389

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$14.285

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Overview

Unlock efficiency with the STM706PM6E from STMicroelectronics, a leader in power management solutions. This compact, reliable IC is designed to enhance performance across various applications, from industrial control to consumer electronics. With its robust operational range and exceptional thermal stability, it ensures your devices run seamlessly while minimizing energy consumption. Choose STM706PM6E for unparalleled quality and innovation that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and protection against environmental factors, ensuring reliability in various applications.

Surface Mount: YES

Surface mount capability allows for easier and more compact circuit designs, facilitating high-density layouts and improved performance.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space usage in PCB design, optimizing the layout for performance and manufacturability.

Nominal Supply Voltage (Vsup): 3 V

A nominal operating voltage of 3V aligns well with standard digital logic levels, making it versatile for various applications.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies enhances usability and allows for integration into different systems without redesigning.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options while maintaining a compact footprint, suitable for space-constrained designs.

Package Style (Meter): SMALL OUTLINE

The small outline style is ideal for modern electronics requiring smaller form factors without sacrificing performance.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C indicates suitability for industrial environments, ensuring reliability under heat stress.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC suitable for harsh and low-temperature environments common in industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finishing ensures excellent solderability and corrosion resistance, enhancing the longevity of the connection.

Terminal Position: DUAL

Dual terminal positioning facilitates easier access and connections, optimizing board layout possibilities.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows the IC to fit into compact designs while maintaining performance and reliability.

Width: 3.9 mm

A width of 3.9 mm keeps the footprint small and manageable for tight layouts, providing design flexibility.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is essential for efficient power distribution, making it a vital component in energy-critical applications.

Minimum Supply Voltage (Vsup): 1.2 V

A low minimum supply voltage of 1.2V enables compatibility with a wider range of modern low-voltage devices, enhancing versatility.

Length: 4.9 mm

The length of 4.9 mm ensures compact integration onto PCBs, making it suitable for space-constrained designs.

Nominal Threshold Voltage (V): +2.63V

A nominal threshold voltage of +2.63V makes the IC suitable for voltage detection applications, ensuring effective circuit operation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability and performance in challenging environments, making it ideal for critical applications.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA indicates energy efficiency, crucial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process and improve handling during manufacturing, enhancing overall production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is compatible with standard PCB layouts, allowing for easy assembly and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for a broader range of use cases, from low-power devices to applications requiring higher voltages.

Technical Specifications

Power Management ICs STM706PM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Width (mm):

3.9 mm

Trade Compliance

STM706PM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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