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STM32MP133FAF7

STMicroelectronics

STM32MP133FAF7 by STMicroelectronics

STM32MP133FAF7 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 105 °C, making it ideal for industrial applications. With low power modes and extensive I/O options, it's perfect for embedded systems.

Median Price

$8.460

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 120 parts In-Stock

1+ parts

$8.460

100+ parts

$5.200

1k+ parts

$4.720

10k+ parts

$4.050

120

$8.460

$5.200

$4.720

$4.050

Mouser Electronics

USA . 515 parts In-Stock

1+ parts

$11.850

100+ parts

$7.630

1k+ parts

$5.720

10k+ parts

-

515

$11.850

$7.630

$5.720

-

Verical

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$5.200

1k+ parts

-

10k+ parts

-

120

-

$5.200

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,950 parts In-Stock

1+ parts

$9.300

100+ parts

-

1k+ parts

-

10k+ parts

-

2,950

$9.300

-

-

-

Vyrian

USA . 1,942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,942

-

-

-

-

Anansix

USA . 753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

753

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 819 parts In-Stock

1+ parts

$8.811

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$8.811

-

-

-

Overview

Unlock limitless possibilities with the STM32MP133FAF7 from STMicroelectronics! Renowned for quality and innovation, STMicroelectronics delivers a microprocessor that excels in low-power performance and robust reliability. Perfect for embedded applications in industrial automation, IoT devices, and consumer electronics, this versatile chip offers superior processing capabilities while ensuring energy efficiency. Elevate your projects with a partner committed to excellence—choose STM32MP133FAF7 for unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and effective thermal management, ensuring reliable performance in various environments.

Integrated Cache: YES

With integrated cache, this microprocessor can execute instructions faster by storing frequently accessed data, enhancing overall system performance.

Surface Mount: YES

The surface mount capability allows for easier integration into compact designs, facilitating efficient assembly and reducing the footprint.

Maximum Supply Voltage: 1.38 V

A maximum supply voltage of 1.38 V ensures compatibility with low-power applications while minimizing energy consumption.

On Chip Data RAM Width: 8

An on-chip data RAM width of 8 bits allows for efficient data processing and enhances the capability for handling multiple operations simultaneously.

Address Bus Width: 26

A wider address bus width of 26 allows for a larger memory addressable space, enabling more extensive applications and better performance.

Package Shape: SQUARE

The square package shape contributes to a uniform layout, making it easy to accommodate in various designs and improve thermal distribution.

Bit Size: 32

A 32-bit architecture supports modern computing requirements, enabling it to handle complex calculations and larger data sets efficiently.

No. of Terminals: 320

A high terminal count of 320 allows for extensive connectivity options, making it suitable for complex systems with multiple peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style facilitates high-density mounting while preserving the thin profile, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.32 V

Operating at a minimum supply voltage of 1.32 V ensures flexibility in power supply options, enhancing energy efficiency.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance even in high-temperature environments, making it ideal for industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows this microprocessor to function in extreme cold conditions, broadening its application range.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier PCB design and assembly, optimizing space and electrical performance.

Maximum Seated Height: 1.2 mm

A low maximum seated height of 1.2 mm is advantageous for compact designs, promoting integration into slim devices.

RAM Words: 172032

Having 172,032 RAM words enhances the data handling capability, aiding complex computations and multitasking applications.

Width: 11 mm

A compact width of 11 mm allows easy integration into small form factor devices without sacrificing performance.

Boundary Scan: YES

Boundary scan capability allows for easier testing and debugging of the circuit, improving product reliability and manufacturing efficiency.

External Data Bus Width: 16

A 16-bit external data bus width supports higher data throughput, making the microprocessor suitable for bandwidth-intensive applications.

Maximum Clock Frequency: 48 MHz

With a maximum clock frequency of 48 MHz, this microprocessor can perform tasks quickly, enhancing overall system responsiveness.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC-based microprocessor, it utilizes streamlined instructions for efficient processing, resulting in lower power consumption and better performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor suitable for portable and battery-powered applications.

Terminal Form: BALL

Ball terminal form aids in easy soldering and provides a stable connection to the circuit board, enhancing reliability.

Maximum Supply Current: 268 mA

A maximum supply current of 268 mA allows for robust performance while maintaining low power usage, which is vital for energy-efficient designs.

Nominal Supply Voltage: 1.35 V

A nominal supply voltage of 1.35 V further emphasizes energy efficiency, allowing for effective power management in applications.

No. of DMA Channels: 56

With 56 DMA channels, this microprocessor can efficiently handle multiple data transfers without CPU intervention, increasing overall system throughput.

No. of Serial I/Os: 10

Having 10 serial I/Os enhances connectivity options, making it versatile for various communication interfaces in different applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense packing on a PCB, making the device ideal for applications with limited space.

Format: FIXED POINT

Using a fixed-point format increases computational efficiency in specific applications, especially in embedded systems that require consistent precision.

Speed: 1000 rpm

Operating at a speed of 1000 rpm indicates a capability for handling real-time processing tasks, making it ideal for various automation applications.

Low Power Mode: YES

The inclusion of a low power mode enhances energy savings during idle times, making it suitable for battery-operated devices.

Technical Specifications

Microprocessors STM32MP133FAF7 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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