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STHS4257L1M6F

STMicroelectronics

STHS4257L1M6F by STMicroelectronics

STHS4257L1M6F by STMicroelectronics is an industrial-grade interface IC with a max operating temp of 85 °C and a min of -40°C. It features an 8-terminal gull-wing design in a compact SO package, ideal for robust applications requiring reliable performance. Its nominal negative supply voltage is -48V, making it suitable for various electronic interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,116 parts In-Stock

1+ parts

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3,116

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Anansix

USA . 1,617 parts In-Stock

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1,617

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Digiode

USA . 503 parts In-Stock

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503

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 53 parts In-Stock

1+ parts

$9.507

100+ parts

-

1k+ parts

$8.557

10k+ parts

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53

$9.507

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$8.557

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MKK Technologies

India . 2,015 parts In-Stock

1+ parts

$17.878

100+ parts

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2,015

$17.878

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DigiPath Technology Company

USA . 2,015 parts In-Stock

1+ parts

$17.878

100+ parts

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2,015

$17.878

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Corphita

USA . 4,499 parts In-Stock

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4,499

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Parana Technologies

USA . 1,463 parts In-Stock

1+ parts

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100+ parts

$11.367

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1,463

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$11.367

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Overview

Elevate your projects with the STHS4257L1M6F from STMicroelectronics, a leader in innovative solutions. Designed for industrial applications, this compact interface IC delivers exceptional reliability across extreme temperatures (-40 °C to 85°C). Its robust plastic/epoxy construction ensures durability, while the surface-mount design simplifies integration into your systems. Experience unmatched performance and efficiency, making it the perfect choice for demanding environments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for a smaller footprint and easier integration into modern compact circuit boards.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts, facilitating easier assembly.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, supporting various circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures efficient use of space and compatibility with automated assembly processes.

Maximum Operating Temperature: 85 °C

A maximum temperature rating of 85 °C makes this IC suitable for use in a wide range of environments, including industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C enhances reliability in extreme conditions, making it suitable for harsh applications.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in layout design, simplifying board integration.

Maximum Seated Height: 1.75 mm

A low seated height allows for better thermal management and accommodates space-constrained designs.

Width: 3.9 mm

A compact width of 3.9 mm supports high-density circuit configurations, fitting well in tight spaces.

Length: 4.9 mm

The short length complements the compact design, facilitating easy placement on circuit boards.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this specification ensures robust performance in demanding applications.

Terminal Form: GULL WING

Gull wing terminals provide a reliable solder joint, ensuring better mechanical stability and electrical connection.

Nominal Negative Supply Voltage: -48 V

A negative supply voltage capability allows this IC to function effectively in specialized applications that require such configurations.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is ideal for high-density applications, ensuring compatibility with various PCB layouts.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC is designed to seamlessly connect different components, enhancing overall system functionality.

Technical Specifications

Other Function Interface ICs STHS4257L1M6F attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Nominal Negative Supply Voltage:

-48 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

STHS4257L1M6F Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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