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STHS4257LM6E

STMicroelectronics

STHS4257LM6E by STMicroelectronics

STHS4257LM6E by STMicroelectronics is an industrial-grade interface IC with a max operating temp of 85 °C and a min of -40°C. It features an 8-terminal gull-wing design in a compact SO package, ideal for robust applications. Its nominal negative supply voltage is -48V, ensuring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,842 parts In-Stock

1+ parts

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2,842

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Anansix

USA . 2,090 parts In-Stock

1+ parts

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2,090

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Vyrian

USA . 1,481 parts In-Stock

1+ parts

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1,481

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 32 parts In-Stock

1+ parts

$13.547

100+ parts

-

1k+ parts

$12.192

10k+ parts

-

32

$13.547

-

$12.192

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MKK Technologies

India . 377 parts In-Stock

1+ parts

$25.474

100+ parts

-

1k+ parts

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377

$25.474

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DigiPath Technology Company

USA . 377 parts In-Stock

1+ parts

$25.474

100+ parts

-

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10k+ parts

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377

$25.474

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Corphita

USA . 1,651 parts In-Stock

1+ parts

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1,651

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Parana Technologies

USA . 1,267 parts In-Stock

1+ parts

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100+ parts

$16.198

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1,267

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$16.198

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Overview

Unlock the potential of your designs with the STHS4257LM6E from STMicroelectronics—a leader in innovative semiconductor solutions. This high-quality interface IC stands out for its reliability and robust performance across diverse applications, from industrial automation to telecommunications. With its compact design and wide temperature tolerance, it ensures seamless integration and long-lasting durability, empowering you to deliver outstanding products and drive efficiency in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material offers excellent durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Being a surface mount device ensures a compact design and allows for automated assembly, leading to reduced production costs and increased efficiency.

Package Shape: RECTANGULAR

The rectangular shape provides versatility in PCB layout and helps save space on the circuit board.

No. of Terminals: 8

With 8 terminals, this IC offers multiple connections, facilitating more complex circuit designs while maintaining a small footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications where space is at a premium, allowing for a denser component arrangement.

Maximum Operating Temperature: 85 °C

Rated for operation up to 85 °C, this IC is suitable for industrial applications where higher temperatures are often encountered.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC can function reliably in extreme cold conditions, expanding its application range.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility, allowing for better integration into various circuit layouts.

Maximum Seated Height: 1.75 mm

A low maximum seated height ensures that this device is compatible with low-profile designs, contributing to slimmer device profiles.

Width: 3.9 mm

A compact width of 3.9 mm aids in fitting into space-constrained applications without compromising performance.

Length: 4.9 mm

With a length of 4.9 mm, this product can easily be accommodated in tight spaces while still meeting connection requirements.

Temperature Grade: INDUSTRIAL

Designed for industrial grade use, this IC is built to withstand harsh conditions and provide reliability in critical applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide a stable connection, improving manufacturing yields and assembly efficiency.

Nominal Negative Supply Voltage: -48 V

The capability to handle a nominal negative supply voltage of -48 V makes this IC suitable for various specialized applications in telecommunications and industrial controls.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for sufficient spacing, reducing the risk of solder bridging and enhancing reliability during operation.

Interface IC Type: INTERFACE CIRCUIT

As an interface IC, this product enables smooth communication between different components, making it crucial for complex electronic systems.

Technical Specifications

Other Function Interface ICs STHS4257LM6E attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Nominal Negative Supply Voltage:

-48 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

STHS4257LM6E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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