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STHS4257LDB6F

STMicroelectronics

STHS4257LDB6F by STMicroelectronics

STHS4257LDB6F by STMicroelectronics is a compact interface IC designed for industrial applications, operating b/w -40 °C to 85°C. It features an 8-terminal, very thin profile with a max reflow temp of 260°C and supports a nominal negative supply voltage of -48V. Ideal for space-constrained environments, it ensures reliable performance with pure tin/nickel palladium gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,783 parts In-Stock

1+ parts

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2,783

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Digiode

USA . 2,579 parts In-Stock

1+ parts

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2,579

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Anansix

USA . 207 parts In-Stock

1+ parts

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207

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$9.579

100+ parts

-

1k+ parts

$8.621

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860

$9.579

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$8.621

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MKK Technologies

India . 278 parts In-Stock

1+ parts

$18.013

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278

$18.013

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DigiPath Technology Company

USA . 278 parts In-Stock

1+ parts

$18.013

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278

$18.013

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Corphita

USA . 4,029 parts In-Stock

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4,029

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Parana Technologies

USA . 836 parts In-Stock

1+ parts

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$11.453

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836

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$11.453

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Overview

Elevate your designs with the STHS4257LDB6F by STMicroelectronics—where quality meets innovation! This compact interface IC is engineered for reliability, ensuring peak performance in challenging environments. With an operating range from -40 °C to 85°C, it thrives in industrial applications, delivering durability and precision. Trust in ST's legacy of excellence to enhance your projects while enjoying the benefits of a sleek, space-saving design that simplifies integration!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of space on modern circuit boards, making it ideal for compact electronic devices.

Package Shape: SQUARE

The square package shape facilitates better placement and thermal performance in tight spaces.

No. of Terminals: 8

Having 8 terminals provides flexibility in design and connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile lend themselves to designs where height is a limitation, promoting effective thermal management.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function in more demanding thermal environments, ensuring reliability.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for harsh environments, including automotive and industrial applications.

Terminal Finish: PURE TIN/NICKEL PALLADIUM GOLD

The premium terminal finish ensures superior solderability and corrosion resistance, enhancing the longevity of connection.

Terminal Position: DUAL

Dual terminal positioning provides increased layout flexibility and can optimize electrical performance in various circuit designs.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm allows for integration in low-profile applications without compromising performance.

Width: 3 mm

A compact width of 3 mm contributes to the overall miniaturization of electronic assemblies, crucial for space-saving designs.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures compatibility with various soldering processes, enhancing manufacturing efficiency.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of up to 260 °C means it is suitable for advanced soldering techniques in high-performance applications.

Length: 3 mm

The 3 mm length supports compact PCB designs, contributing to a smaller overall product footprint.

Temperature Grade: INDUSTRIAL

Being industrial-grade guarantees reliable performance in industrial settings, ensuring durability and resilience.

Terminal Form: NO LEAD

No lead terminals contribute to a reduced environmental footprint and enhance compatibility with RoHS compliant manufacturing.

Nominal Negative Supply Voltage: -48 V

The capability to handle a nominal negative supply voltage of -48 V makes this IC suitable for powerful interface applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density mounting on PCBs, maximizing circuit board real estate.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it is designed to facilitate interaction between different components, making it essential for complex electronic systems.

Technical Specifications

Other Function Interface ICs STHS4257LDB6F attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3/e4

Length:

3 mm

Nominal Negative Supply Voltage:

-48 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

PURE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

STHS4257LDB6F Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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