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STHS4257AM6F

STMicroelectronics

STHS4257AM6F by STMicroelectronics

STHS4257AM6F by STMicroelectronics is an industrial-grade interface IC with a -48V nominal negative supply voltage. It features an 8-terminal gull-wing design, operating b/w -40 °C and 85°C. Ideal for surface mount applications, it ensures reliable performance in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,663 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,663

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Vyrian

USA . 3,021 parts In-Stock

1+ parts

-

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1k+ parts

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3,021

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Anansix

USA . 2,522 parts In-Stock

1+ parts

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10k+ parts

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2,522

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,992 parts In-Stock

1+ parts

$9.045

100+ parts

-

1k+ parts

$8.140

10k+ parts

-

1,992

$9.045

-

$8.140

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MKK Technologies

India . 538 parts In-Stock

1+ parts

$17.008

100+ parts

-

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538

$17.008

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DigiPath Technology Company

USA . 538 parts In-Stock

1+ parts

$17.008

100+ parts

-

1k+ parts

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10k+ parts

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538

$17.008

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-

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Parana Technologies

USA . 2,363 parts In-Stock

1+ parts

-

100+ parts

$10.814

1k+ parts

-

10k+ parts

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2,363

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$10.814

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Corphita

USA . 441 parts In-Stock

1+ parts

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441

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Overview

Unlock new possibilities with the STHS4257AM6F from STMicroelectronics, a premier solution in interface circuit technology. Designed for industrial applications, this compact and robust device ensures reliability in extreme temperatures, enhancing performance in demanding environments. Benefit from ST's renowned quality and innovation, ensuring your projects achieve optimal functionality while reducing time-to-market. Elevate your designs with confidence and experience seamless integration today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resilience, making the product suitable for a wide range of industrial applications.

Surface Mount: YES

Surface mount technology allows for smaller circuit boards and easier assembly, which is perfect for modern electronic designs.

Package Shape: RECTANGULAR

The rectangular shape offers efficient space utilization and is compatible with various PCB layouts.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for diverse interfacing needs in electronic applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact solution, ideal for space-constrained designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suited for environments with moderate thermal demands.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this IC reliable in extreme cold conditions, enhancing its versatility.

Terminal Position: DUAL

Dual terminal positioning facilitates easy integration into circuit designs, improving layout flexibility.

Maximum Seated Height: 1.75 mm

A low seated height helps maintain a slim profile in compact devices, contributing to overall design efficiency.

Width: 3.9 mm

A width of 3.9 mm allows for precise placement in tight spaces, beneficial for high-density applications.

Length: 4.9 mm

The length of 4.9 mm is well-suited for many compact electronic designs, ensuring compatibility with various layouts.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees reliability under harsh operating conditions, making it optimal for industrial applications.

Terminal Form: GULL WING

Gull wing terminals provide a strong, stable connection to PCBs, enhancing mechanical durability and electrical performance.

Nominal Negative Supply Voltage: -48 V

The ability to handle a nominal negative supply voltage of -48 V makes this IC suitable for applications requiring high voltage capabilities.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with various PCB configurations, ensuring ease of assembly.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC serves as a crucial component for communication between different electronic systems, enhancing functionality.

Technical Specifications

Other Function Interface ICs STHS4257AM6F attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Nominal Negative Supply Voltage:

-48 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

STHS4257AM6F Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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