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STHS4257LDB6E

STMicroelectronics

STHS4257LDB6E by STMicroelectronics

STHS4257LDB6E by STMicroelectronics is a compact interface IC designed for industrial applications, featuring an operating temp range of -40 °C to 85°C. It has a small outline package with 8 terminals and supports a nominal negative supply voltage of -48V. Ideal for space-constrained environments, it ensures reliable performance with a peak reflow temp of 260°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,776 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,776

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Vyrian

USA . 1,368 parts In-Stock

1+ parts

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-

1k+ parts

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1,368

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Anansix

USA . 211 parts In-Stock

1+ parts

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100+ parts

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211

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,027 parts In-Stock

1+ parts

$7.673

100+ parts

-

1k+ parts

$6.906

10k+ parts

-

1,027

$7.673

-

$6.906

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MKK Technologies

India . 1,977 parts In-Stock

1+ parts

$14.428

100+ parts

-

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10k+ parts

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1,977

$14.428

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DigiPath Technology Company

USA . 1,977 parts In-Stock

1+ parts

$14.428

100+ parts

-

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10k+ parts

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1,977

$14.428

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Parana Technologies

USA . 513 parts In-Stock

1+ parts

-

100+ parts

$9.174

1k+ parts

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513

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$9.174

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Corphita

USA . 506 parts In-Stock

1+ parts

-

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506

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Overview

Unlock exceptional performance with the STHS4257LDB6E from STMicroelectronics—a leader in innovative technology. This cutting-edge interface IC is designed for demanding applications, offering unparalleled reliability in extreme temperatures from -40 °C to 85°C. Its compact size and advanced thermal management make it ideal for space-constrained environments. Enhance your designs with this robust solution that promises efficiency, durability, and peace of mind for your projects!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space-saving installation and automated assembly, making this product ideal for compact applications.

Package Shape: SQUARE

A square package shape optimizes layout flexibility on PCBs, facilitating better performance in dense electronic designs.

No. of Terminals: 8

Having 8 terminals ensures sufficient connectivity for various interface functions while maintaining a compact form factor.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style supports space-constrained designs and enables the use of heat sinks for enhanced thermal management, which increases reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature rating ensures reliability in demanding environments and contributes to overall durability.

Minimum Operating Temperature: -40 °C

With a broad temperature range, this product is suitable for use in extreme conditions, making it versatile for various industrial applications.

Terminal Finish: PURE TIN/NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and ensures long-term reliability, reducing corrosion risks and improving overall longevity.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB design, allowing for simplified routing and layout optimization.

Maximum Seated Height: 1 mm

A low seated height contributes to the product's thin profile, which is ideal for slim designs and limited space applications.

Width: 3 mm

The compact 3 mm width helps save space on the PCB while providing the necessary connectivity for various functions.

Maximum Time At Peak Reflow Temperature: 40 s

The relatively short maximum time at peak reflow temperature allows for efficient integration into manufacturing processes, minimizing thermal stress.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with modern soldering techniques, supporting efficient and reliable assembly.

Length: 3 mm

The 3 mm length, alongside its width, makes the product exceptionally compact, suitable for densely populated PCB layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets stringent reliability standards, making it fit for mission-critical environments.

Terminal Form: NO LEAD

The no-lead terminal form enhances the product’s environmental profile and facilitates compact designs, aiding in compliance with RoHS standards.

Nominal Negative Supply Voltage: -48 V

This nominal voltage rating makes the product suitable for high-performance applications that require robust negative supply configurations.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows high-density interconnections while still maintaining ease of manufacturing and assembly.

Interface IC Type: INTERFACE CIRCUIT

Being classified as an interface circuit indicates its capability to efficiently manage communication signals, making it essential in various interface applications.

Technical Specifications

Other Function Interface ICs STHS4257LDB6E attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3/e4

Length:

3 mm

Nominal Negative Supply Voltage:

-48 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

PURE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

STHS4257LDB6E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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