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STHS4257L1DB6E

STMicroelectronics

STHS4257L1DB6E by STMicroelectronics

STHS4257L1DB6E by STMicroelectronics is a compact interface IC designed for industrial applications, operating b/w -40 °C to 85°C. It features an 8-terminal, no-lead design with a max reflow temp of 260°C and a nominal negative supply voltage of -48V. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,012 parts In-Stock

1+ parts

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3,012

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Anansix

USA . 642 parts In-Stock

1+ parts

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642

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Digiode

USA . 170 parts In-Stock

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170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 666 parts In-Stock

1+ parts

$12.753

100+ parts

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1k+ parts

$11.478

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666

$12.753

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$11.478

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MKK Technologies

India . 2,042 parts In-Stock

1+ parts

$23.981

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2,042

$23.981

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DigiPath Technology Company

USA . 2,042 parts In-Stock

1+ parts

$23.981

100+ parts

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2,042

$23.981

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Parana Technologies

USA . 1,793 parts In-Stock

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$15.248

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1,793

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$15.248

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Corphita

USA . 647 parts In-Stock

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647

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Overview

Unlock unparalleled performance with the STHS4257L1DB6E from STMicroelectronics! Renowned for its commitment to quality, STMicroelectronics delivers this innovative interface IC designed for industrial applications. With its compact, heat-efficient profile and robust temperature resilience, this solution ensures reliability in demanding environments. Elevate your designs with the STHS4257L1DB6E and experience enhanced functionality, durability, and peace of mind for your projects!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact placement on PCBs, saving space and enabling high-density layouts.

Package Shape: SQUARE

Square package shape enhances layout flexibility and helps in optimizing thermal performance.

No. of Terminals: 8

With eight terminals, this product offers multiple connections, enhancing functionality and versatility in applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile make it ideal for compact electronic devices, contributing to overall system miniaturization.

Maximum Operating Temperature: 85 °C

Operating at temperatures up to 85 °C ensures reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold conditions (-40 °C) makes it suitable for harsh climates and rugged applications.

Terminal Finish: PURE TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and long-term corrosion resistance, enhancing durability.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and simplifies routing on printed circuit boards.

Maximum Seated Height: 1 mm

A low seated height supports design in slim assemblies, catering to modern aesthetic and space needs.

Width: 3 mm

Compact width allows for efficient use of PCB space and easy integration into various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures compatibility with standard manufacturing processes without damaging the IC.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports compatibility with high-temperature soldering processes, enhancing production efficiency.

Length: 3 mm

Its short length facilitates space-saving designs while maintaining effective functionality in applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specification guarantees reliability and performance in challenging environments.

Terminal Form: NO LEAD

The no-lead design contributes to reduced footprint and improved thermal performance, making it ideal for compact applications.

Nominal Negative Supply Voltage: -48 V

A nominal negative supply voltage of -48V allows for versatile use in various interface applications requiring negative voltages.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density configurations on PCBs, perfect for modern electronics.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this IC enhances communication between different components, ensuring seamless integration in complex electronic systems.

Technical Specifications

Other Function Interface ICs STHS4257L1DB6E attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3/e4

Length:

3 mm

Nominal Negative Supply Voltage:

-48 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

PURE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

STHS4257L1DB6E Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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