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STGWA60V60DWFAG

STMicroelectronics

STGWA60V60DWFAG by STMicroelectronics

STGWA60V60DWFAG from STMicroelectronics is a robust N-channel IGBT designed for power control applications. It features a max VCEsat of 2.3V, supports up to 600V collector-emitter voltage, and operates efficiently at temperatures from -55 °C to 175 °C. Ideal for high-power systems, it ensures reliable performance with a built-in diode.

Median Price

$8.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 600 parts In-Stock

1+ parts

$8.880

100+ parts

$4.486

1k+ parts

$3.938

10k+ parts

-

600

$8.880

$4.486

$3.938

-

Avnet

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,029 parts In-Stock

1+ parts

$9.756

100+ parts

-

1k+ parts

-

10k+ parts

-

4,029

$9.756

-

-

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Vyrian

USA . 6,545 parts In-Stock

1+ parts

-

100+ parts

-

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6,545

-

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-

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Anansix

USA . 2,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,081

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 474 parts In-Stock

1+ parts

$0.347

100+ parts

-

1k+ parts

$0.312

10k+ parts

-

474

$0.347

-

$0.312

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MKK Technologies

India . 1,607 parts In-Stock

1+ parts

$0.652

100+ parts

-

1k+ parts

-

10k+ parts

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1,607

$0.652

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-

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DigiPath Technology Company

USA . 1,607 parts In-Stock

1+ parts

$0.652

100+ parts

-

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-

10k+ parts

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1,607

$0.652

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-

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Corphita

USA . 1,510 parts In-Stock

1+ parts

$9.243

100+ parts

-

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-

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1,510

$9.243

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-

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Microchip USA

USA . 7,598 parts In-Stock

1+ parts

$37.492

100+ parts

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7,598

$37.492

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Component Stockers USA

USA . 459 parts In-Stock

1+ parts

$131.070

100+ parts

-

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459

$131.070

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iodParts Technologies Inc.

India . 74,979 parts In-Stock

1+ parts

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100+ parts

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74,979

-

-

-

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Parana Technologies

USA . 1,867 parts In-Stock

1+ parts

-

100+ parts

$0.415

1k+ parts

-

10k+ parts

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1,867

-

$0.415

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Overview

Experience unparalleled performance with the STGWA60V60DWFAG from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics brings you this robust IGBT solution designed for efficient power control in demanding applications. With exceptional thermal management and a compact design, this N-channel transistor ensures reliability while maximizing efficiency—empowering your projects to achieve peak performance effortlessly. Elevate your designs with a trusted partner that delivers cutting-edge technology and unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental stresses, making this IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Being an N-channel IGBT allows for high-speed operation and efficient switching capabilities, making it ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances performance by allowing for reverse recovery, thus improving efficiency in various circuit designs.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is perfect for applications requiring efficient handling of high voltage and current.

Maximum VCEsat: 2.3 V

With a low saturation voltage, this IGBT minimizes power losses during operation, resulting in improved efficiency.

Package Shape: RECTANGULAR

The rectangular shape is conducive to easier mounting and better space utilization on circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole design facilitates better mechanical stability and is compatible with soldering techniques commonly used in electronic assemblies.

Nominal Turn Off Time (toff): 280 ns

A short turn-off time enhances switching speed, making this IGBT suitable for high-frequency applications.

No. of Terminals: 3

The three-terminal configuration allows for simplified connections while providing the necessary functionality for operation.

Maximum Power Dissipation (Abs): 375 W

Capable of handling high power dissipation, this IGBT can be used in applications requiring significant power management.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides secure mounting options, enhancing reliability in demanding environments.

Maximum Operating Temperature: 175 °C

Designed to operate at high temperatures, this IGBT is suitable for applications in harsh environments.

Maximum Collector-Emitter Voltage: 600 V

A high collector-emitter voltage rating allows for use in high-voltage applications without risking breakdown.

Transistor Element Material: SILICON

Silicon as the semiconductor material ensures good thermal management and reliability in operation.

Maximum Gate-Emitter Voltage: 20 V

This high gate-emitter voltage rating allows for robust gate driving capabilities, improving switching performance.

Minimum Operating Temperature: -55 °C

Withstanding low temperatures makes this IGBT suitable for applications in extreme conditions.

Maximum Collector Current (IC): 80 A

High collector current rating enables operation under heavy load conditions, enhancing versatility in application.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderately low threshold voltage allows for easier control and drive circuitry, simplifying design.

Terminal Position: SINGLE

Having a single terminal position simplifies layout and reduces potential complexity in circuit designs.

Case Connection: COLLECTOR

Direct connection to the collector allows for efficient circuit design, ensuring optimal performance.

Nominal Turn On Time (ton): 55 ns

A quick turn-on time enhances operational efficiency in high-speed switching applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 ensures high reliability and quality standards, making this IGBT suitable for automotive and high-reliability applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA60V60DWFAG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

280 ns

Nominal Turn On Time (ton):

55 ns

Maximum VCEsat:

2.3 V

Trade Compliance

STGWA60V60DWFAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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