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STGWA30IH65DF

STMicroelectronics

STGWA30IH65DF by STMicroelectronics

STGWA30IH65DF from STMicroelectronics is a robust N-channel IGBT designed for power control applications. It features a max VCEsat of 2.05V, supports up to 60A collector current, and operates efficiently b/w -55 °C to 175 °C. Ideal for high-power switching tasks in various electronic systems.

Median Price

$1.578

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$1.578

1k+ parts

$1.243

10k+ parts

-

600

-

$1.578

$1.243

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,157 parts In-Stock

1+ parts

$2.052

100+ parts

-

1k+ parts

-

10k+ parts

-

3,157

$2.052

-

-

-

Vyrian

USA . 3,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,191

-

-

-

-

Anansix

USA . 823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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823

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,197 parts In-Stock

1+ parts

$1.339

100+ parts

-

1k+ parts

$1.205

10k+ parts

-

2,197

$1.339

-

$1.205

-

Corphita

USA . 4,624 parts In-Stock

1+ parts

$1.944

100+ parts

-

1k+ parts

-

10k+ parts

-

4,624

$1.944

-

-

-

Continental Prestige Electronics

USA . 19 parts In-Stock

1+ parts

$2.060

100+ parts

$1.330

1k+ parts

-

10k+ parts

-

19

$2.060

$1.330

-

-

MKK Technologies

India . 1,334 parts In-Stock

1+ parts

$2.517

100+ parts

-

1k+ parts

-

10k+ parts

-

1,334

$2.517

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

$2.517

100+ parts

-

1k+ parts

-

10k+ parts

-

1,334

$2.517

-

-

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Microchip USA

USA . 2,529 parts In-Stock

1+ parts

$20.995

100+ parts

-

1k+ parts

-

10k+ parts

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2,529

$20.995

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-

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Parana Technologies

USA . 1,892 parts In-Stock

1+ parts

-

100+ parts

$1.600

1k+ parts

-

10k+ parts

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1,892

-

$1.600

-

-

Overview

Elevate your power control solutions with the STGWA30IH65DF from STMicroelectronics, a leader in cutting-edge semiconductor technology. This N-channel IGBT delivers exceptional performance and reliability, operating effectively in extreme temperatures and demanding conditions. Its built-in diode and robust design provide seamless integration for applications like renewable energy systems and industrial drives, ensuring maximized efficiency and longevity. Trust in STMicroelectronics to power your future with innovative solutions that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides lightweight yet sturdy protection against environmental factors, making the IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and better performance in power electronics, making this product ideal for demanding applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for enhanced performance in power control applications by enabling freewheeling current paths, reducing component count.

Transistor Application: POWER CONTROL

Optimized for power control, this IGBT excels in applications such as motor drives, power inverters, and energy-efficient systems.

Maximum VCEsat: 2.05 V

A low maximum VCEsat indicates less power loss during operation, enhancing overall efficiency and thermal performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, facilitating easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and ease of soldering, ensuring reliable connections in various applications.

Nominal Turn Off Time (toff): 312 ns

A nominal turn-off time of 312 ns ensures fast switching capabilities, making it suitable for high-frequency applications.

No. of Terminals: 3

With three terminals, this IGBT simplifies circuitry while allowing comprehensive control for effective performance.

Maximum Power Dissipation (Abs): 180 W

A maximum power dissipation of 180 W means the IGBT can operate in high-power applications without thermal issues.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides robust mechanical attachment options, suitable for high-power applications where stability is crucial.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures, this IGBT ensures reliable performance in environments with elevated thermal conditions.

Maximum Collector-Emitter Voltage: 650 V

A maximum collector-emitter voltage of 650 V provides the flexibility to handle a wide range of voltage applications.

Transistor Element Material: SILICON

Silicon as the transistor element material ensures good thermal conductivity and efficiency in switching applications.

Maximum Gate-Emitter Voltage: 20 V

This high maximum gate-emitter voltage allows for greater control over the switching characteristics of the IGBT.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this IGBT is suitable for extreme environments and applications.

Maximum Collector Current (IC): 60 A

A maximum collector current of 60 A enables the use of this IGBT in high-power applications, ensuring effective current handling.

Maximum Gate-Emitter Threshold Voltage: 7 V

The 7 V threshold voltage provides excellent control over the turn-on characteristics, making it user-friendly in circuit designs.

Terminal Position: SINGLE

Single terminal position streamlines designs and simplifies assembly, making it easier to work with in various applications.

Case Connection: COLLECTOR

Having the case connection to the collector helps in efficient thermal management and improved electrical performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA30IH65DF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

312 ns

Maximum VCEsat:

2.05 V

Trade Compliance

STGWA30IH65DF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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