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STGWA25H120DF2

STMicroelectronics

STGWA25H120DF2 by STMicroelectronics

STGWA25H120DF2 by STMicroelectronics is an N-CHANNEL IGBT with VCEsat of 2.6V, IC of 50A, and Pmax of 375W. Ideal for power control applications due to its fast turn-off time (toff) of 339ns and high collector-emitter voltage of 1200V. Package style: FLANGE MOUNT, suitable for high-power operations in various industries.

Median Price

$6.910

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 392 parts In-Stock

1+ parts

$6.400

100+ parts

$3.649

1k+ parts

$2.600

10k+ parts

$2.549

392

$6.400

$3.649

$2.600

$2.549

Chip1Stop

Japan . 600 parts In-Stock

1+ parts

$7.420

100+ parts

$6.250

1k+ parts

$5.150

10k+ parts

-

600

$7.420

$6.250

$5.150

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EBV Elektronik

Germany . 2,610 parts In-Stock

1+ parts

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2,610

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Avnet

USA . 600 parts In-Stock

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600

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Distributors (In-Stock)

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Digiode

USA . 1,443 parts In-Stock

1+ parts

$4.123

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1,443

$4.123

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Flip Electronics

USA . 30,000 parts In-Stock

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30,000

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Vyrian

USA . 7,078 parts In-Stock

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7,078

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Anansix

USA . 1,480 parts In-Stock

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1,480

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ComSIT USA

USA . 600 parts In-Stock

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600

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,610 parts In-Stock

1+ parts

$1.534

100+ parts

-

1k+ parts

$1.380

10k+ parts

-

1,610

$1.534

-

$1.380

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MKK Technologies

India . 2,067 parts In-Stock

1+ parts

$2.884

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2,067

$2.884

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DigiPath Technology Company

USA . 2,067 parts In-Stock

1+ parts

$2.884

100+ parts

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2,067

$2.884

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Corphita

USA . 504 parts In-Stock

1+ parts

$3.906

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504

$3.906

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Ampacity Inc.

Singapore . 1,406 parts In-Stock

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$4.050

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1,406

$4.050

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Component Stockers USA

USA . 460 parts In-Stock

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$5.970

100+ parts

$4.260

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460

$5.970

$4.260

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A-Z Elektronik GmbH

Germany . 6,723 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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RC Electronics

USA . 1,883 parts In-Stock

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$37.590

1k+ parts

$34.100

10k+ parts

$32.900

1,883

-

$37.590

$34.100

$32.900

Parana Technologies

USA . 1,168 parts In-Stock

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$1.834

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1,168

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$1.834

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Perfect Parts

USA . 840 parts In-Stock

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840

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Eastek

USA . 90 parts In-Stock

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Kepictronics

USA . 80 parts In-Stock

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Overview

Unleash the power of innovation with the STGWA25H120DF2 Insulated Gate Bipolar Transistor by STMicroelectronics. Designed for superior performance in power control applications, this N-CHANNEL transistor offers a maximum VCEsat of 2.6V and a maximum collector-emitter voltage of 1200V. With a flange mount package style and built-in diode configuration, this transistor provides reliable and efficient power management. Trust in STMicroelectronics' reputation for quality and excellence, and elevate your projects to new heights with the STGWA25H120DF2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection for the transistor, ensuring durability and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with freewheeling in inductive loads, improving the efficiency and reliability of power control operations.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is capable of handling high power dissipation and efficient voltage regulation.

Maximum VCEsat: 2.6 V

The low VCEsat value indicates minimal voltage drop across the collector-emitter terminals, leading to lower power losses and improved efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into existing electronic systems or circuit boards.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering and connection process, making installation easier and more secure.

Nominal Turn Off Time (toff): 339 ns

The fast turn off time ensures quick switching speeds, reducing power losses and improving overall performance in power control applications.

No. of Terminals: 3

Having 3 terminals allows for easy connection to external circuitry, enabling efficient control and regulation of power output.

Maximum Power Dissipation (Abs): 375 W

With a high maximum power dissipation value, this IGBT can handle large power loads without overheating or performance degradation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides a secure and stable mounting solution for the IGBT, preventing movement or damage during operation.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature capacity allows this IGBT to operate reliably in a wide range of environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating makes this IGBT suitable for high voltage applications, ensuring stable and efficient power control.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing good electrical properties and durability for long-term performance.

Maximum Gate-Emitter Voltage: 20 V

The high maximum gate-emitter voltage rating ensures reliable and stable operation of the IGBT, even under high voltage control signals.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this IGBT to operate in extreme cold environments, making it suitable for a variety of applications.

Maximum Collector Current (IC): 50 A

With a high maximum collector current rating, this IGBT can handle large current loads while maintaining stability and efficiency in power control operations.

Maximum Gate-Emitter Threshold Voltage: 7 V

The maximum gate-emitter threshold voltage ensures proper turn-on and turn-off operations, preventing overheating or damage to the IGBT.

Terminal Position: SINGLE

Having a single terminal position simplifies connections and reduces the risk of wiring errors, ensuring safe and reliable operation of the IGBT.

Nominal Turn On Time (ton): 41 ns

The fast turn on time allows for quick switching speeds and efficient power control, leading to improved performance and reduced power losses.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA25H120DF2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

339 ns

Nominal Turn On Time (ton):

41 ns

Maximum VCEsat:

2.6 V

Trade Compliance

STGWA25H120DF2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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