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STGWA15S120DF3

STMicroelectronics

STGWA15S120DF3 by STMicroelectronics

STGWA15S120DF3 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.05V, supports up to 1200V collector-emitter voltage, and operates at temperatures from -55 °C to 175 °C. Ideal for high-performance applications, it ensures reliable operation with a built-in diode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,862 parts In-Stock

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4,862

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Anansix

USA . 1,662 parts In-Stock

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1,662

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Digiode

USA . 920 parts In-Stock

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920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 350 parts In-Stock

1+ parts

$0.619

100+ parts

-

1k+ parts

$0.557

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350

$0.619

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$0.557

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MKK Technologies

India . 1,776 parts In-Stock

1+ parts

$1.164

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1,776

$1.164

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DigiPath Technology Company

USA . 1,776 parts In-Stock

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$1.164

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1,776

$1.164

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Andel Nordic

Denmark . 3,284 parts In-Stock

1+ parts

$2.290

100+ parts

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$2.198

10k+ parts

$2.198

3,284

$2.290

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$2.198

$2.198

AZTECH Wire

Italy . 184 parts In-Stock

1+ parts

$22.030

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184

$22.030

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Component Stockers USA

USA . 530 parts In-Stock

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$99.990

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530

$99.990

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Parana Technologies

USA . 2,346 parts In-Stock

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$0.740

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2,346

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$0.740

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Corphita

USA . 2,082 parts In-Stock

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2,082

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Overview

Elevate your power control systems with the STGWA15S120DF3 IGBT from STMicroelectronics, a leader renowned for exceptional quality and innovation. This robust N-channel transistor is designed for efficiency, featuring a built-in diode and superior thermal performance up to 175 °C. Whether you're in industrial automation or renewable energy, this reliable component ensures optimal performance, reduced energy loss, and enhanced durability, empowering you to achieve your project goals with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and mechanical strength, making it durable and reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient switching and handling of high current loads, making it suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode feature simplifies design, reduces component count, and enhances overall system reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can manage higher power levels effectively, making it ideal for applications like motor drives.

Maximum VCEsat: 2.05 V

Low VCEsat ensures reduced power loss during operation, enhancing energy efficiency and thermal management.

Package Shape: RECTANGULAR

The rectangular package shape allows for robust heat dissipation and easier integration into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical stability and reliable connections, particularly useful in high-power applications.

Nominal Turn Off Time (toff): 584 ns

A fast turn off time improves the efficiency of switching applications, allowing for higher frequency operation.

No. of Terminals: 3

With three terminals, this IGBT offers straightforward connections, aiding in easier integration and circuit design.

Maximum Power Dissipation (Abs): 259 W

High power dissipation capability ensures reliable performance under demanding conditions, making it suitable for heavy-duty applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure installation and enhances the thermal management of the device, contributing to improved performance.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature increases reliability and allows operation in harsher environments without compromising performance.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating enables this IGBT to be used in a wide range of applications, from industrial machinery to renewable energy systems.

Transistor Element Material: SILICON

Silicon as the material provides good thermal conductivity and stability, ensuring long-term performance of the device.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage allows for better control of the switching characteristics, enhancing the versatility of the device.

Minimum Operating Temperature: -55 °C

A wide operating temperature range makes this IGBT suitable for both extreme cold and hot environments, improving its application scope.

Maximum Collector Current (IC): 30 A

With a 30 A collector current capability, it is suitable for high-power applications, ensuring it can handle demanding loads.

Maximum Gate-Emitter Threshold Voltage: 7 V

A low threshold voltage enables efficient operation and reduces the complexity of interfacing with control circuits.

Terminal Position: SINGLE

Single terminal position simplifies layout and design, allowing for more efficient use of board space.

Case Connection: COLLECTOR

Direct collector connection provides solid performance and enhances thermal management in applications requiring high power.

Nominal Turn On Time (ton): 31.2 ns

A fast turn on time contributes to better performance in switching applications, allowing for rapid response and increased efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA15S120DF3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

584 ns

Nominal Turn On Time (ton):

31.2 ns

Maximum VCEsat:

2.05 V

Trade Compliance

STGWA15S120DF3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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