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STGW80H65DFB-4

STMicroelectronics

STGW80H65DFB-4 by STMicroelectronics

STGW80H65DFB-4 by STMicroelectronics is an N-CHANNEL IGBT with VCEsat of 2V and IC of 120A. Ideal for POWER CONTROL applications, it has a max VCE of 650V and can handle up to 470W power dissipation. With fast ton of 104ns and toff of 448ns, this IGBT operates in temperatures ranging from -55°C to 175°C.

Median Price

$3.704

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 246 parts In-Stock

1+ parts

$8.260

100+ parts

$5.010

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$4.170

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246

$8.260

$5.010

$4.170

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Arrow

USA . 1,200 parts In-Stock

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$3.704

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$3.704

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Verical

USA . 1,200 parts In-Stock

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$3.704

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1,200

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$3.704

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Distributors (In-Stock)

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Digiode

USA . 490 parts In-Stock

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$7.210

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490

$7.210

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Chip Stock

USA . 10,680 parts In-Stock

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10,680

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Vyrian

USA . 7,002 parts In-Stock

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7,002

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Anansix

USA . 2,465 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 5,829 parts In-Stock

1+ parts

$0.804

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-

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5,829

$0.804

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IDEA Electronic Components Group

UK . 1,634 parts In-Stock

1+ parts

$1.253

100+ parts

-

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$1.128

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1,634

$1.253

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$1.128

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MKK Technologies

India . 342 parts In-Stock

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$2.356

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342

$2.356

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DigiPath Technology Company

USA . 342 parts In-Stock

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$2.356

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342

$2.356

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Corohmni

South Africa . 883 parts In-Stock

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$5.717

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883

$5.717

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Ampacity Inc.

Singapore . 303 parts In-Stock

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$6.450

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303

$6.450

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Semicontronic

India . 263 parts In-Stock

1+ parts

$6.450

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$6.289

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$6.256

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263

$6.450

$6.289

$6.256

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Corphita

USA . 1,722 parts In-Stock

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$6.831

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$6.831

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AZTECH Wire

Italy . 823 parts In-Stock

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$13.171

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823

$13.171

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Microchip USA

USA . 2,588 parts In-Stock

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$15.030

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$15.030

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QUARKTWIN TECHNOLOGY LTD

USA . 28,652 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Lixinc

USA . 9,533 parts In-Stock

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Continental Prestige Electronics

USA . 6,495 parts In-Stock

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Argo Parts USA

USA . 2,314 parts In-Stock

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Parana Technologies

USA . 793 parts In-Stock

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$1.498

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793

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iodParts Technologies Inc.

India . 442 parts In-Stock

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442

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unleash the power of your electronics with the STGW80H65DFB-4 by STMicroelectronics. This Insulated Gate Bipolar Transistor (IGBT) is a game-changer in power control applications, offering unmatched quality and reliability. With a maximum collector-emitter voltage of 650V and a maximum collector current of 120A, this transistor is designed to handle high-power tasks with ease. Whether you're working on industrial machinery or renewable energy systems, the STGW80H65DFB-4 delivers superior performance and efficiency. Trust STMicroelectronics for cutting-edge technology that brings your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and low conduction losses, making the product suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Offers added functionality with a built-in diode, simplifying circuit design and reducing component count.

Maximum VCEsat: 2 V

Low VCEsat value indicates lower power dissipation and higher efficiency during operation.

Package Shape: RECTANGULAR

Facilitates easy mounting and installation of the transistor in various electronic circuits.

Nominal Turn Off Time (toff): 448 ns

Fast turn-off time allows for precise control and switching of the transistor, making it suitable for high-speed applications.

Maximum Power Dissipation (Abs): 470 W

High power dissipation capability enables the transistor to handle large power loads without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures reliable performance in varying environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

High VCE voltage rating allows the transistor to be used in high voltage applications.

Maximum Gate-Emitter Voltage: 20 V

Sufficient gate-emitter voltage rating for proper control and switching of the transistor.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments without affecting performance.

Maximum Collector Current (IC): 120 A

High collector current rating makes the transistor capable of handling large currents.

Maximum Gate-Emitter Threshold Voltage: 7 V

Threshold voltage ensures proper turn-on of the transistor for efficient operation.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and solderability for reliable connections.

Terminal Position: SINGLE

Single terminal position for easy connection in electronic circuits.

Case Connection: COLLECTOR

Collector case connection for efficient heat dissipation and improved thermal characteristics.

Nominal Turn On Time (ton): 104 ns

Fast turn-on time allows for quick response and switching of the transistor.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW80H65DFB-4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

448 ns

Nominal Turn On Time (ton):

104 ns

Maximum VCEsat:

2 V

Trade Compliance

STGW80H65DFB-4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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