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STGW45NC60WD

STMicroelectronics

STGW45NC60WD by STMicroelectronics

STGW45NC60WD by STMicroelectronics is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 90A max collector current, and 285W max power dissipation. Ideal for power control applications due to its single configuration with built-in diode and fast turn-off time of 280ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,884 parts In-Stock

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2,884

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Anansix

USA . 1,024 parts In-Stock

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1,024

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Digiode

USA . 220 parts In-Stock

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220

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,242 parts In-Stock

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$1.656

100+ parts

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$1.490

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$1.656

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$1.490

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MKK Technologies

India . 2,259 parts In-Stock

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$3.114

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$3.114

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DigiPath Technology Company

USA . 2,259 parts In-Stock

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$3.114

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2,259

$3.114

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AZTECH Wire

Italy . 883 parts In-Stock

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$8.820

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883

$8.820

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Corphita

USA . 4,740 parts In-Stock

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4,740

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Perfect Parts

USA . 2,873 parts In-Stock

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2,873

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A-Z Elektronik GmbH

Germany . 1,614 parts In-Stock

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1,614

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Parana Technologies

USA . 402 parts In-Stock

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$1.980

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402

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$1.980

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Overview

Unlock the power of efficient and reliable power control with the STGW45NC60WD Insulated Gate Bipolar Transistor by STMicroelectronics. Manufactured with precision and expertise, this N-channel transistor offers a single configuration with a built-in diode, making it ideal for various power control applications. With a maximum collector-emitter voltage of 600V and a maximum operating temperature of 150 °C, this transistor ensures optimal performance and durability. Experience seamless power management with the STGW45NC60WD and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and high performance in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and helps in reducing component count, leading to cost savings.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and reliability.

Package Shape: RECTANGULAR

Compact design and easy mounting, suitable for various installation requirements.

Terminal Form: THROUGH-HOLE

Provides secure and stable connections, making installation and maintenance easier.

Nominal Turn Off Time (toff): 280 ns

Quick turn off time ensures efficient power management and reduces heat generation.

Maximum Power Dissipation (Abs): 285 W

Can handle high power levels, suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Allows for easy mounting and heat dissipation, improving overall performance.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, suitable for various industrial environments.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltage levels, ensuring compatibility with a wide range of applications.

Transistor Element Material: SILICON

Provides high efficiency and reliability, ensuring stable performance over time.

Maximum Gate-Emitter Voltage: 20 V

Allows for precise control over the transistor, ensuring accurate power management.

Maximum Collector Current (IC): 90 A

Can handle high current levels, suitable for power-intensive applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

Ensures efficient switching and control of the transistor, improving overall performance.

Terminal Finish: Matte Tin (Sn)

Provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: SINGLE

Simplifies installation and maintenance, making it user-friendly.

Nominal Turn On Time (ton): 46 ns

Quick turn on time ensures rapid response and precise power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW45NC60WD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

280 ns

Nominal Turn On Time (ton):

46 ns

Trade Compliance

STGW45NC60WD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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