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STGW35NC60WD

STMicroelectronics

STGW35NC60WD by STMicroelectronics

STGW35NC60WD by STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, a power dissipation of 250 W, and operates at up to 150 °C. Its fast switching times (ton: 42.5 ns, toff: 197 ns) enhance performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,203 parts In-Stock

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Digiode

USA . 2,361 parts In-Stock

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2,361

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Anansix

USA . 1,733 parts In-Stock

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1,733

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Martec Srl

Italy . 23 parts In-Stock

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$1.625

100+ parts

$1.479

1k+ parts

$1.332

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-

20

$1.625

$1.479

$1.332

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IDEA Electronic Components Group

UK . 1,817 parts In-Stock

1+ parts

$1.685

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$1.517

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1,817

$1.685

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$1.517

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MKK Technologies

India . 1,205 parts In-Stock

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$3.169

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$3.169

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DigiPath Technology Company

USA . 1,205 parts In-Stock

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$3.169

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1,205

$3.169

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AZTECH Wire

Italy . 784 parts In-Stock

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$8.700

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784

$8.700

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Corphita

USA . 2,768 parts In-Stock

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2,768

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Parana Technologies

USA . 2,101 parts In-Stock

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$2.015

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2,101

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$2.015

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Perfect Parts

USA . 34 parts In-Stock

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Overview

Unlock unparalleled efficiency and reliability with the STGW35NC60WD IGBT from STMicroelectronics. Renowned for its commitment to quality, STMicroelectronics delivers a powerhouse designed for exceptional power control in diverse applications—from renewable energy systems to industrial automation. With superior thermal performance and built-in diode functionality, this N-channel transistor ensures seamless operation, helping you boost productivity while reducing energy costs. Elevate your projects with the assurance of a leading manufacturer behind every component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and thermal efficiency, making this IGBT reliable in harsh environments.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer lower on-state voltage drop, improving efficiency in high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional functionality for reverse current flow, enhancing the versatility of the device in power control circuits.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT operates effectively in switching and regulating electrical power.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient heat dissipation and easier integration into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are ideal for a variety of PCB configurations, enhancing mounting reliability.

Nominal Turn Off Time (toff): 197 ns

A relatively short turn-off time contributes to higher switching frequencies, improving overall system efficiency in dynamic applications.

No. of Terminals: 3

The three-terminal configuration simplifies connections and allows for straightforward integration within electronic circuits.

Maximum Power Dissipation (Abs): 250 W

With a maximum power dissipation of 250 W, this IGBT can handle significant power loads, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides excellent mounting options, ensuring stability and ease of cooling for high-power applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating allows this IGBT to function reliably in extreme thermal conditions, enhancing its application range.

Maximum Collector-Emitter Voltage: 600 V

The capability of handling up to 600 V allows this device to be used in high-voltage applications, improving its versatility across various systems.

Transistor Element Material: SILICON

Silicon as the base material ensures good thermal conductivity and performance characteristics, making this IGBT a robust choice for power applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20 V supports effective control and drive circuits, increasing operational safety and reliability.

Maximum Collector Current (IC): 70 A

With a maximum collector current capability of 70 A, this IGBT is suitable for handling substantial power loads in industrial applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A gate-emitter threshold voltage of 5.75 V ensures good switching performance, allowing for efficient operation in various drive conditions.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and allows for easier installation in compact electronic layouts.

Nominal Turn On Time (ton): 42.5 ns

The fast turn-on time of 42.5 ns allows for quick responses in high-frequency applications, enhancing system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW35NC60WD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

197 ns

Nominal Turn On Time (ton):

42.5 ns

Trade Compliance

STGW35NC60WD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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