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STGW35HF60WDI

STMicroelectronics

STGW35HF60WDI by STMicroelectronics

STGW35HF60WDI from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, a turn-off time of just 295 ns, and can handle up to 200 W dissipation. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,721 parts In-Stock

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8,721

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Digiode

USA . 546 parts In-Stock

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546

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Anansix

USA . 541 parts In-Stock

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541

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,153 parts In-Stock

1+ parts

$1.226

100+ parts

-

1k+ parts

$1.104

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2,153

$1.226

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$1.104

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MKK Technologies

India . 1,863 parts In-Stock

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$2.306

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1,863

$2.306

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DigiPath Technology Company

USA . 1,863 parts In-Stock

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$2.306

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1,863

$2.306

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AZTECH Wire

Italy . 36 parts In-Stock

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$11.230

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36

$11.230

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Component Stockers USA

USA . 525 parts In-Stock

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$99.990

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525

$99.990

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Corphita

USA . 3,065 parts In-Stock

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3,065

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 2,984 parts In-Stock

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2,984

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A-Z Elektronik GmbH

Germany . 833 parts In-Stock

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833

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Parana Technologies

USA . 811 parts In-Stock

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$1.466

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811

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$1.466

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Overview

Unlock the power of efficiency with the STGW35HF60WDI from STMicroelectronics, your trusted partner in advanced semiconductor technology. This high-performance IGBT delivers exceptional power control for a variety of applications, ensuring reliability and superior thermal management. With its robust design and rapid switching capabilities, it promises unmatched performance and longevity, enabling you to enhance your systems while reducing energy consumption. Elevate your projects with ST’s commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental stress, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and good switching performance, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode enhances performance in power control applications, allowing for better handling of reverse recovery and reducing the need for external components.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT can efficiently manage high voltages and currents, ideal for converters and inverters.

Package Shape: RECTANGULAR

The rectangular package shape aids in ease of mounting and heat dissipation, contributing to overall performance and reliability.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and ease of soldering, ensuring a stable connection during operation.

Nominal Turn Off Time (toff): 295 ns

A fast turn-off time improves efficiency in switching applications, reducing losses and enabling higher operational frequencies.

No. of Terminals: 3

Three terminals provide flexibility in circuit design, allowing for various configurations and easy integration into existing systems.

Maximum Power Dissipation (Abs): 200 W

The high maximum power dissipation capability allows for better thermal management, ensuring the device operates efficiently without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates secure installation and better thermal conductivity, promoting longevity and reliability in various setups.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures makes this IGBT suitable for demanding environments, enhancing its versatility in different applications.

Maximum Collector-Emitter Voltage: 600 V

With a maximum voltage of 600 V, this IGBT can handle high voltage applications effectively, making it suitable for industrial use.

Transistor Element Material: SILICON

Silicon as a semiconductor material ensures good thermal conductivity and reliability, enhancing the performance of the IGBT.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows for flexibility in driving the IGBT, making it easier to interface with control circuits.

Maximum Collector Current (IC): 60 A

The high collector current rating supports significant power handling capability, ideal for heavy-duty power electronics applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

The threshold voltage ensures efficient triggering of the IGBT, which enhances sensitivity and performance in various circuits.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish ensures good solderability and corrosion resistance, which contributes to long-term reliability in various environments.

Terminal Position: SINGLE

A single terminal position simplifies layout design and integration in compact electronic systems.

Nominal Turn On Time (ton): 45 ns

With a quick turn-on time, this IGBT enhances system responsiveness and operational efficiency in fast switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW35HF60WDI attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

295 ns

Nominal Turn On Time (ton):

45 ns

Trade Compliance

STGW35HF60WDI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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