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STGW30NC60W

STMicroelectronics

STGW30NC60W by STMicroelectronics

STGW30NC60W from STMicroelectronics is a powerful N-channel IGBT ideal for motor control applications. It features a max collector-emitter voltage of 600 V, power dissipation of 200 W, and operates at up to 150 °C. Its fast switching times enhance efficiency in various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,821 parts In-Stock

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8,821

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Digiode

USA . 2,752 parts In-Stock

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2,752

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Anansix

USA . 885 parts In-Stock

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885

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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5

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IDEA Electronic Components Group

UK . 820 parts In-Stock

1+ parts

$1.278

100+ parts

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$1.150

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820

$1.278

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$1.150

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MKK Technologies

India . 1,559 parts In-Stock

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$2.403

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1,559

$2.403

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DigiPath Technology Company

USA . 1,559 parts In-Stock

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$2.403

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1,559

$2.403

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AZTECH Wire

Italy . 796 parts In-Stock

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$19.190

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796

$19.190

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A-Z Elektronik GmbH

Germany . 6,149 parts In-Stock

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Corphita

USA . 3,470 parts In-Stock

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3,470

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Parana Technologies

USA . 1,190 parts In-Stock

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$1.528

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1,190

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$1.528

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Perfect Parts

USA . 806 parts In-Stock

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806

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Overview

Unlock unparalleled efficiency with the STGW30NC60W from STMicroelectronics, a premier choice for motor control applications. Designed with precision and reliability in mind, this N-channel IGBT excels in demanding environments, offering robust performance and quick switching capabilities. With STMicroelectronics' legacy of innovation, you can trust in superior quality and long-lasting durability, allowing your projects to thrive with optimal power management and reduced energy costs. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the IGBT suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for higher efficiency in switching applications and is typically preferred for high-power circuits.

Configuration: SINGLE

A single configuration reduces complexity while providing adequate performance for motor control applications.

Transistor Application: MOTOR CONTROL

This IGBT is specifically designed for motor control, ensuring reliable operation in various motor drive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into compact designs and improves thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical stability and ease of soldering, ensuring a strong electrical connection.

Nominal Turn Off Time (toff): 189 ns

A fast turn-off time improves switching efficiency, enabling higher frequency operation which is beneficial for applications like PWM in motor control.

No. of Terminals: 3

The three terminals provide a straightforward connection for gate, collector, and emitter, simplifying circuit design.

Maximum Power Dissipation (Abs): 200 W

A high power dissipation rating allows the IGBT to handle significant power loads, reducing the risk of overheating in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides robust thermal conductivity and mounting stability, making it suitable for high-performance systems.

Maximum Operating Temperature: 150 °C

The capability to operate at high temperatures increases reliability in challenging environments.

Maximum Collector-Emitter Voltage: 600 V

A high voltage rating allows for versatility in various applications, providing strong performance in high-voltage environments.

Transistor Element Material: SILICON

Silicon as the base material ensures good conductivity and performance characteristics, making it a common choice for IGBTs.

Maximum Gate-Emitter Voltage: 20 V

A sufficient gate-emitter voltage range ensures compatibility with most control circuits and enhances operational flexibility.

Maximum Collector Current (IC): 60 A

A high collector current rating enables the device to support substantial loads, ideal for industrial applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A low threshold voltage means faster switching and more efficient driving characteristics, making this IGBT easier to control.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish improves oxidation resistance, ensuring longevity and reliability of connections.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and ensures ease of integration into various applications.

Nominal Turn On Time (ton): 42.5 ns

A quick turn-on time enhances switching performance, making this IGBT suitable for high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW30NC60W attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

189 ns

Nominal Turn On Time (ton):

42.5 ns

Trade Compliance

STGW30NC60W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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