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STGW20NB60KD

STMicroelectronics

STGW20NB60KD by STMicroelectronics

STGW20NB60KD from STMicroelectronics is a powerful N-channel IGBT ideal for motor control applications. It features a max collector-emitter voltage of 600V, power dissipation of 150W, and fast switching times (ton: 76ns, toff: 280ns). Its robust design ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,171 parts In-Stock

1+ parts

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7,171

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Digiode

USA . 4,637 parts In-Stock

1+ parts

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4,637

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Anansix

USA . 1,897 parts In-Stock

1+ parts

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1,897

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.942

100+ parts

$0.857

1k+ parts

$0.772

10k+ parts

-

200

$0.942

$0.857

$0.772

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IDEA Electronic Components Group

UK . 2 parts In-Stock

1+ parts

$1.341

100+ parts

-

1k+ parts

$1.207

10k+ parts

-

2

$1.341

-

$1.207

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MKK Technologies

India . 430 parts In-Stock

1+ parts

$2.522

100+ parts

-

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430

$2.522

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DigiPath Technology Company

USA . 430 parts In-Stock

1+ parts

$2.522

100+ parts

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430

$2.522

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AZTECH Wire

Italy . 917 parts In-Stock

1+ parts

$10.210

100+ parts

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917

$10.210

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Parana Technologies

USA . 1,274 parts In-Stock

1+ parts

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100+ parts

$1.604

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1,274

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$1.604

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Corphita

USA . 1,054 parts In-Stock

1+ parts

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1,054

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Overview

Elevate your designs with the STGW20NB60KD from STMicroelectronics, a leader in high-quality semiconductor solutions. This N-Channel IGBT offers exceptional efficiency and reliability, perfect for motor control applications. With its robust power handling capabilities and fast switching times, it ensures optimal performance while reducing energy consumption. Choose STMicroelectronics for innovation, quality, and support that maximizes your project's potential!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent insulation and durability, making the IGBT suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel devices typically offer better switching characteristics and are commonly preferred in efficient power conversion applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration in circuit designs, simplifying the pick-and-place process in manufacturing.

Transistor Application: MOTOR CONTROL

Optimized for motor control, this IGBT can efficiently manage power and ensure smooth operation in various motor applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCB layouts, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and ease of handling during manufacturing.

Nominal Turn Off Time (toff): 280 ns

A short turn-off time helps to increase the overall efficiency of the system by reducing energy losses during switching.

No. of Terminals: 3

With three terminals, this IGBT allows for simple and versatile circuit configurations.

Maximum Power Dissipation (Abs): 150 W

This high power dissipation capability enables the IGBT to manage larger loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide effective heat dissipation and stability for demanding applications.

Maximum Operating Temperature: 150 °C

A high operating temperature allows for reliability in extreme conditions, making this IGBT suitable for harsh environments.

Maximum Collector-Emitter Voltage: 600 V

This high voltage rating allows for use in higher voltage applications, providing flexibility in design.

Transistor Element Material: SILICON

Silicon ensures high performance and reliability, making this IGBT a trustworthy choice for various applications.

Maximum Gate-Emitter Voltage: 20 V

A higher gate-emitter voltage tolerance allows for better control and flexibility in driving the IGBT in varied circuits.

Maximum Collector Current (IC): 40 A

This maximum current rating supports substantial load requirements, suitable for heavy-duty applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A low threshold voltage allows for efficient driving of the IGBT with standard control circuits.

Terminal Finish: MATTE TIN

Matte tin provides excellent solderability, enhancing the reliability and robustness of connections.

Terminal Position: SINGLE

With a single terminal position, this IGBT facilitates easier layout and integration into compact designs.

Nominal Turn On Time (ton): 76 ns

A quick turn-on time enhances switching performance, leading to improved efficiency in fast switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW20NB60KD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

280 ns

Nominal Turn On Time (ton):

76 ns

Trade Compliance

STGW20NB60KD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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