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STGW100H65FB2-4

STMicroelectronics

STGW100H65FB2-4 by STMicroelectronics

STGW100H65FB2-4 from STMicroelectronics is an N-channel IGBT designed for power control applications. It features a max VCEsat of 2V, supports up to 441W power dissipation, and operates b/w -55 °C to 175 °C. Ideal for high-efficiency switching in industrial systems.

Median Price

$9.640

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 29 parts In-Stock

1+ parts

$5.180

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$5.180

-

-

-

Mouser Electronics

USA . 42 parts In-Stock

1+ parts

$9.120

100+ parts

$4.390

1k+ parts

$4.380

10k+ parts

-

42

$9.120

$4.390

$4.380

-

DigiKey

USA . 68 parts In-Stock

1+ parts

$9.640

100+ parts

$5.687

1k+ parts

$4.386

10k+ parts

-

68

$9.640

$5.687

$4.386

-

Newark

USA . 29 parts In-Stock

1+ parts

$10.730

100+ parts

$7.140

1k+ parts

$6.850

10k+ parts

-

29

$10.730

$7.140

$6.850

-

Element14

Singapore . 29 parts In-Stock

1+ parts

$10.940

100+ parts

$6.630

1k+ parts

$6.500

10k+ parts

-

29

$10.940

$6.630

$6.500

-

Avnet

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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600

-

-

-

-

RS (Exports)

UK . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,874 parts In-Stock

1+ parts

$5.529

100+ parts

-

1k+ parts

-

10k+ parts

-

2,874

$5.529

-

-

-

Vyrian

USA . 4,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

4,624

-

-

-

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Anansix

USA . 2,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,692

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 17 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

$0.272

10k+ parts

-

17

$0.303

-

$0.272

-

MKK Technologies

India . 2,273 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

2,273

$0.569

-

-

-

DigiPath Technology Company

USA . 2,273 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

2,273

$0.569

-

-

-

Corphita

USA . 2,540 parts In-Stock

1+ parts

$5.238

100+ parts

-

1k+ parts

-

10k+ parts

-

2,540

$5.238

-

-

-

Continental Prestige Electronics

USA . 76 parts In-Stock

1+ parts

$5.680

100+ parts

$4.220

1k+ parts

-

10k+ parts

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76

$5.680

$4.220

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-

Microchip USA

USA . 9,106 parts In-Stock

1+ parts

$24.780

100+ parts

-

1k+ parts

-

10k+ parts

-

9,106

$24.780

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

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Parana Technologies

USA . 1,888 parts In-Stock

1+ parts

-

100+ parts

$0.362

1k+ parts

-

10k+ parts

-

1,888

-

$0.362

-

-

Overview

Elevate your power control solutions with the STGW100H65FB2-4 IGBT from STMicroelectronics, a leader in innovative semiconductor technology. This high-quality N-channel device offers exceptional efficiency and reliability, ensuring optimal performance across various applications, from industrial automation to renewable energy systems. With its robust design and impressive thermal management, enjoy enhanced durability while reducing overall system costs. Trust STMicroelectronics for a superior edge in your power management needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to temperature variations, making the product suitable for diverse operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide efficient switching performance, making this IGBT ideal for power control applications.

Configuration: SINGLE

A single configuration allows for simpler design and easier integration into various circuits.

Transistor Application: POWER CONTROL

Designed for power control, this IGBT can handle high current and voltage, making it perfect for industrial applications.

Maximum VCEsat: 2 V

A low VCEsat value indicates reduced energy losses during operation, improving overall efficiency in power applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization in circuit designs and facilitates easier mounting.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust and stable connections, which are essential for high-power applications.

Nominal Turn Off Time (toff): 255 ns

A short turn-off time enhances the performance of switching applications, allowing for faster operation.

No. of Terminals: 4

Four terminals facilitate better circuit integration and allow for a more versatile application range.

Maximum Power Dissipation (Abs): 441 W

High power dissipation capability makes this IGBT suitable for handling substantial loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design ensures secure placement and stability in various applications, enhancing reliability.

Maximum Operating Temperature: 175 °C

A high operating temperature rating enables the IGBT to function efficiently in harsh environments.

Maximum Collector-Emitter Voltage: 650 V

A high voltage rating allows for use in high-voltage applications, broadening its application spectrum.

Transistor Element Material: SILICON

Silicon provides excellent electrical characteristics and thermal stability, ensuring reliable operation.

Maximum Gate-Emitter Voltage: 20 V

A higher gate-emitter voltage enables improved control over the transistor, allowing for versatile applications.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures expands the usability of the IGBT in extreme conditions.

Maximum Collector Current (IC): 145 A

A high maximum collector current allows the IGBT to handle significant current loads, making it powerful in applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

This threshold voltage enables reliable switching, ensuring the transistor operates effectively in various circuits.

Terminal Position: SINGLE

Single terminal position simplifies layout and design in PCB applications, making integration more straightforward.

Case Connection: COLLECTOR

Collector case connection optimal for effective heat dissipation and improved performance in power electronics.

Nominal Turn On Time (ton): 49 ns

A quick turn-on time improves efficiency in switching operations, essential for high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW100H65FB2-4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

255 ns

Nominal Turn On Time (ton):

49 ns

Maximum VCEsat:

2 V

Trade Compliance

STGW100H65FB2-4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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