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STGP20H65FB2

STMicroelectronics

STGP20H65FB2 by STMicroelectronics

STGP20H65FB2 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2.1V, supports up to 650V collector-emitter voltage, and operates at temperatures from -55 °C to 175 °C. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,173 parts In-Stock

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8,173

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Anansix

USA . 1,494 parts In-Stock

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1,494

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Digiode

USA . 1,305 parts In-Stock

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1,305

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,081 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

$0.907

10k+ parts

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2,081

$1.007

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$0.907

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MKK Technologies

India . 1,656 parts In-Stock

1+ parts

$1.894

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1,656

$1.894

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DigiPath Technology Company

USA . 1,656 parts In-Stock

1+ parts

$1.894

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1,656

$1.894

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Microchip USA

USA . 3,523 parts In-Stock

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$5.802

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3,523

$5.802

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AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$19.710

100+ parts

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374

$19.710

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Corphita

USA . 3,199 parts In-Stock

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3,199

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Parana Technologies

USA . 1,665 parts In-Stock

1+ parts

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100+ parts

$1.204

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1,665

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$1.204

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Overview

Unlock the power of efficiency with the STGP20H65FB2 IGBT from STMicroelectronics. Renowned for unparalleled quality, STMicroelectronics ensures that this N-channel transistor delivers superior performance in demanding power control applications. With a robust design and optimal thermal management, it thrives in extreme conditions while maximizing energy savings. Elevate your projects with reliability and durability—experience the exceptional value this component brings to your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are generally more efficient in terms of conductivity, offering better performance in power control applications.

Configuration: SINGLE

A single configuration simplifies circuit design and layout, making it easier to implement in power control systems.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT excels in managing high voltage and current loads.

Maximum VCEsat: 2.1 V

A low VCEsat value indicates higher efficiency and lower power losses during operation, contributing to better overall performance.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for space-saving layouts and effective heat dissipation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide sturdy mechanical support and reliable electrical connections, enhancing durability in applications.

Nominal Turn Off Time (toff): 178 ns

A fast turn-off time allows for quicker switching, which is advantageous in high-frequency applications.

No. of Terminals: 3

Having three terminals facilitates easy integration into various circuit designs while maintaining functionality.

Maximum Power Dissipation (Abs): 147 W

High power dissipation capability allows this IGBT to handle demanding applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style enables secure installation while improving thermal conduction, thus enhancing reliability.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature ensures reliable performance even under extreme conditions.

Maximum Collector-Emitter Voltage: 650 V

High voltage capability allows this IGBT to be used in various high-voltage applications, making it versatile.

Transistor Element Material: SILICON

Silicon is a standard material that offers good electrical properties, ensuring stability and performance.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage provides flexibility in gate drive circuits, allowing for compatibility with various control schemes.

Minimum Operating Temperature: -55 °C

This low minimum operating temperature ensures that the IGBT can function in harsh environmental conditions.

Maximum Collector Current (IC): 40 A

With a maximum collector current of 40 A, this product is suitable for high-power applications, enhancing its versatility.

Maximum Gate-Emitter Threshold Voltage: 7 V

A reasonable threshold voltage allows for effective control and easy driving of the IGBT in various circuits.

Terminal Position: SINGLE

Single terminal position simplifies and streamlines the design process, allowing for compact circuit layouts.

Case Connection: COLLECTOR

Collector case connection efficiently manages heat dissipation and ensures stable operation under load.

Nominal Turn On Time (ton): 26 ns

A quick turn-on time enhances the efficiency of switching applications, allowing for faster device operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP20H65FB2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

178 ns

Nominal Turn On Time (ton):

26 ns

Maximum VCEsat:

2.1 V

Trade Compliance

STGP20H65FB2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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