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STD4NK50Z-1

STMicroelectronics

STD4NK50Z-1 by STMicroelectronics

STD4NK50Z-1 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 500V breakdown voltage, 12A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic circuits.

Median Price

$0.422

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,152 parts In-Stock

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-

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7,152

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-

-

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Digiode

USA . 3,072 parts In-Stock

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-

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3,072

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-

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Bristol Electronics

USA . 2,175 parts In-Stock

1+ parts

-

100+ parts

$0.422

1k+ parts

$0.315

10k+ parts

$0.292

2,175

-

$0.422

$0.315

$0.292

Dan-Mar Components

USA . 2,175 parts In-Stock

1+ parts

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2,175

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Anansix

USA . 1,946 parts In-Stock

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1,946

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Cyclops Electronics Ltd

UK . 1,875 parts In-Stock

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1,875

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Microfarads

USA . 1,715 parts In-Stock

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1,715

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Pegasus Components GmbH

Germany . 910 parts In-Stock

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910

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,063 parts In-Stock

1+ parts

$0.279

100+ parts

-

1k+ parts

$0.251

10k+ parts

-

2,063

$0.279

-

$0.251

-

MKK Technologies

India . 1,721 parts In-Stock

1+ parts

$0.524

100+ parts

-

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1,721

$0.524

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DigiPath Technology Company

USA . 1,721 parts In-Stock

1+ parts

$0.524

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-

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1,721

$0.524

-

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AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$17.180

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819

$17.180

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Ampacity Inc.

Singapore . 1,351 parts In-Stock

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$51.050

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1,351

$51.050

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Perfect Parts

USA . 34,297 parts In-Stock

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34,297

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Cyclops Electronics Ltd (Excess)

UK . 9,590 parts In-Stock

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9,590

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Alle Elektronik GmbH

Germany . 3,060 parts In-Stock

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3,060

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Parana Technologies

USA . 1,613 parts In-Stock

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$0.333

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1,613

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$0.333

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Corphita

USA . 1,178 parts In-Stock

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1,178

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Overview

Unlock the power of innovation with the STD4NK50Z-1 from STMicroelectronics, a leader in high-quality semiconductor solutions. This cutting-edge N-channel power FET is designed for efficient switching applications, delivering exceptional performance and reliability. With a robust breakdown voltage and built-in diode, it ensures durability in demanding environments. Elevate your projects with this versatile component that embodies ST's commitment to excellence, offering unparalleled value and peace of mind for engineers and designers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection against environmental factors, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance in terms of on-resistance and switching speed, making them a preferred choice for efficient power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps prevent reverse current flow, enhancing the transistor's performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast, reliable operation essential for modern electronic circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage provides excellent insulation and stability, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on PCBs, making it easier to integrate into various designs.

Terminal Form: THROUGH-HOLE

Through-hole design offers robust mechanical stability and makes soldering easier, ensuring reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption when the FET is in the off state, ideal for energy-efficient designs.

Maximum Pulsed Drain Current (IDM): 12 A

A high pulsed drain current capability allows the transistor to handle dynamic load conditions effectively, enhancing its versatility.

Avalanche Energy Rating (EAS): 120 mJ

With a decent avalanche energy rating, this FET can withstand transient voltage events, increasing the resilience of the circuit.

Maximum Drain Current (Abs) (ID): 3 A

Providing a reasonable maximum current rating makes this transistor suitable for various low to medium-power applications.

No. of Terminals: 3

The three-terminal design simplifies integration into circuits while allowing effective control over the FET's operation.

Maximum Power Dissipation (Abs): 45 W

A high power dissipation capacity ensures the transistor can operate under significant loads without overheating, increasing reliability.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy placement and alignment on circuit boards, streamlining the manufacturing process.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency, low on-resistance, and fast switching speeds, ideal for modern power electronics.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows for robust performance under demanding thermal conditions, enhancing durability.

Transistor Element Material: SILICON

Silicon as a material provides excellent electrical properties and thermal conductivity, making this transistor highly effective.

Terminal Finish: MATTE TIN

Matte tin finish provides a good balance of conductivity and corrosion resistance, ensuring reliable long-term performance.

Maximum Drain Current (ID): 3 A

This maximum drain current rating ensures versatility in its application for a variety of power handling tasks.

Maximum Drain-Source On Resistance: 2.7 ohm

A low on-resistance minimizes power loss and heat generation during operation, enhancing efficiency and performance.

Terminal Position: SINGLE

The single terminal position simplifies PCB layout and design, making it easier to work with in electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STD4NK50Z-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

120 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

2.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD4NK50Z-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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