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STD40NF06LZ

STMicroelectronics

STD40NF06LZ by STMicroelectronics

STD40NF06LZ by STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a max drain current of 40 A, breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for compact power management solutions in electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,323 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,323

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Anansix

USA . 2,769 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,769

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Digiode

USA . 2,481 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,481

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,637 parts In-Stock

1+ parts

$1.671

100+ parts

-

1k+ parts

$1.504

10k+ parts

-

1,637

$1.671

-

$1.504

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MKK Technologies

India . 650 parts In-Stock

1+ parts

$3.142

100+ parts

-

1k+ parts

-

10k+ parts

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650

$3.142

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DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$3.142

100+ parts

-

1k+ parts

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10k+ parts

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650

$3.142

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-

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Corphita

USA . 3,736 parts In-Stock

1+ parts

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3,736

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Kepictronics

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Parana Technologies

USA . 699 parts In-Stock

1+ parts

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100+ parts

$1.998

1k+ parts

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10k+ parts

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699

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$1.998

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Overview

Unlock the power of efficiency with the STD40NF06LZ from STMicroelectronics, a leader in innovation and quality. This high-performance N-channel FET is designed for seamless switching applications, ensuring reliability and optimal functionality in your electronic designs. Ideal for various industries—from automotive to industrial automation—its robust construction delivers outstanding thermal management and energy savings, empowering you to achieve superior performance in every project. Experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in providing durability and resistance to environmental factors, making this FET suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better efficiency and can handle higher currents compared to P-channel devices, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by providing protection and improving efficiency, enhancing the overall effectiveness of switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET allows for fast operation, low power losses and efficient control in electronic circuits.

Surface Mount: YES

Surface mount capability aids in miniaturization of circuits, allowing for better use of space and easier integration into compact electronic designs.

Minimum DS Breakdown Voltage: 60 V

A breakdown voltage of 60 V ensures reliable performance in various high-voltage applications, providing a safety margin for user circuits.

Package Shape: RECTANGULAR

The rectangular package shape is standard for many applications, facilitating convenient layout options on printed circuit boards (PCBs).

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical stability, ensuring robust connections on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for operation in a fully off state when not energized, leading to lower power consumption and increased efficiency when in use.

Maximum Pulsed Drain Current (IDM): 160 A

A high pulsed drain current capability allows the FET to handle dynamic loads and peak demands in applications, making it highly versatile.

Avalanche Energy Rating (EAS): 450 mJ

This rating indicates the device can handle energy spikes, enhancing reliability in transient environments, such as during system start-up.

Maximum Drain Current (Abs) (ID): 40 A

The maximum drain current rating offers plenty of headroom for power applications, ensuring effective operation without risk of failure.

No. of Terminals: 2

A simplified two-terminal design reduces circuit complexity, making this FET easy to integrate into a variety of circuits.

Maximum Power Dissipation (Abs): 100 W

A maximum power dissipation rating of 100 W indicates that this FET can efficiently manage heat without thermal issues, ensuring stable operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for higher density layouts on PCBs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high efficiency and speed, offering improved performance in digital and high-frequency applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature indicates that the device can function effectively in extreme conditions, increasing its usability in harsh environments.

Transistor Element Material: SILICON

Silicon is a widely used material for FETs, providing a well-established balance of performance, cost, and availability.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and improves the reliability of connections in the production process.

Maximum Drain Current (ID): 40 A

This rating ensures the FET can support significant current loads, making it suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.03 ohm

A low on-resistance value minimizes power loss during operation, improving system efficiency and reducing heat generation.

Terminal Position: SINGLE

Having a single terminal position simplifies layout and circuit design, making it easier to work with in prototyping.

Technical Specifications

Power Field Effect Transistors (FET) STD40NF06LZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

450 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD40NF06LZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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