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STD40NF06

STMicroelectronics

STD40NF06 by STMicroelectronics

STD40NF06 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 40 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for high-efficiency power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,389 parts In-Stock

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4,389

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Digiode

USA . 1,271 parts In-Stock

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1,271

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Anansix

USA . 277 parts In-Stock

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277

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 994 parts In-Stock

1+ parts

$0.404

100+ parts

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$0.363

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994

$0.404

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$0.363

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MKK Technologies

India . 1,105 parts In-Stock

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$0.759

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1,105

$0.759

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DigiPath Technology Company

USA . 1,105 parts In-Stock

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$0.759

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1,105

$0.759

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Kepictronics

USA . 20,000 parts In-Stock

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20,000

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Corphita

USA . 4,163 parts In-Stock

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4,163

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Parana Technologies

USA . 127 parts In-Stock

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$0.483

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127

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$0.483

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Overview

Elevate your electronic designs with the STD40NF06 from STMicroelectronics, a leader in power solutions. This robust N-channel FET excels in switching applications, ensuring superior performance and reliability for all your projects. With its compact design and impressive current handling, it seamlessly integrates into space-constrained environments. Trust in STMicroelectronics' quality and innovation to enhance efficiency and durability, delivering exceptional value for your high-performance needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for better electron mobility, resulting in higher efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and provides protection against reverse polarity situations.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control high-speed signals and improve overall circuit performance.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, making it ideal for modern electronics.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60 V provides reliability and is suitable for a wide range of applications, ensuring safe operation.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs, helping designers optimize layout.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical stability, ensuring reliable connections in electronic assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and improved performance in switching applications.

Maximum Pulsed Drain Current (IDM): 160 A

The high maximum pulsed drain current enables the FET to handle significant current spikes, enhancing its robustness in demanding applications.

Avalanche Energy Rating (EAS): 250 mJ

A high avalanche energy rating indicates the FET's ability to handle transient conditions, providing additional reliability in surge situations.

Maximum Drain Current (Abs) (ID): 40 A

The high maximum drain current rating allows for effective handling of significant loads, making it suitable for high-power applications.

No. of Terminals: 2

A simple two-terminal design simplifies integration into circuits, making it easy to use in various applications.

Maximum Power Dissipation (Abs): 85 W

With a maximum power dissipation of 85 W, this FET can efficiently manage heat, enhancing durability in high-performance scenarios.

Package Style (Meter): SMALL OUTLINE

The small outline package contributes to space-saving designs, critical for modern compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOS technology, this FET offers high input impedance and faster switching speeds, making it highly efficient.

Maximum Operating Temperature: 175 °C

A high operating temperature range allows for versatile applications in harsh environments, ensuring reliability under stress.

Transistor Element Material: SILICON

Silicon is a standard material known for its efficiency and effectiveness in semiconductor devices, ensuring consistent performance.

Terminal Finish: TIN LEAD

A tin-lead finish enhances solderability and ensures reliable connections within electronic circuits.

Maximum Drain Current (ID): 40 A

Reiterating the maximum drain current capability, this feature ensures versatility in handling a variety of load conditions.

Maximum Drain-Source On Resistance: 0.028 ohm

A low on-resistance minimizes power loss during operation, increasing efficiency and thermal performance in switching applications.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout, reducing complexity for engineers.

Case Connection: DRAIN

Direct drain connection facilitates better integration into existing circuits, improving ease of use and functionality.

Technical Specifications

Power Field Effect Transistors (FET) STD40NF06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

250 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD40NF06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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