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STD40NF06T4

STMicroelectronics

STD40NF06T4 by STMicroelectronics

STD40NF06T4 from STMicroelectronics is a robust N-channel MOSFET ideal for switching applications. It features a max drain current of 40 A, breakdown voltage of 60 V, and operates at up to 175 °C. Its compact design ensures efficient performance in power management systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,999 parts In-Stock

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4,999

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Anansix

USA . 1,048 parts In-Stock

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1,048

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Digiode

USA . 436 parts In-Stock

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436

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 59 parts In-Stock

1+ parts

$0.874

100+ parts

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$0.787

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59

$0.874

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$0.787

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MKK Technologies

India . 812 parts In-Stock

1+ parts

$1.644

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812

$1.644

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DigiPath Technology Company

USA . 812 parts In-Stock

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$1.644

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812

$1.644

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 3,408 parts In-Stock

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3,408

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Parana Technologies

USA . 2,065 parts In-Stock

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$1.045

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$1.045

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Overview

Unlock powerful performance with the STD40NF06T4 from STMicroelectronics, a trusted name in the semiconductor industry. This cutting-edge N-channel power FET ensures exceptional efficiency and reliability for your switching applications, making it ideal for automotive, industrial, and consumer electronics. Experience reduced energy loss and enhanced thermal management, empowering your designs to achieve more with less. Choose ST for unmatched quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection, making the product durable and reliable in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and performance, making them suitable for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection and simplifies design, while supporting efficient switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, this product can handle rapid on/off cycles, improving overall circuit performance.

Surface Mount: YES

Surface mount technology allows for smaller PCB footprints and easier automated assembly, enhancing manufacturing efficiency.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60 V ensures reliable performance in higher voltage applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, facilitating flexible circuit design options.

Terminal Form: GULL WING

Gull wing terminals allow for better solderability and mechanical stability, ensuring reliable connections in use.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation contributes to lower power loss and improved efficiency, making it ideal for power management applications.

Maximum Pulsed Drain Current (IDM): 160 A

A high pulsed drain current capability allows this FET to handle transient loads effectively, enhancing versatility in various applications.

Avalanche Energy Rating (EAS): 250 mJ

A substantial avalanche energy rating indicates robust handling of voltage spikes, offering protection in harsh conditions.

Maximum Drain Current (Abs) (ID): 40 A

Sustaining up to 40 A of drain current makes it suitable for demanding applications without overheating or failure.

No. of Terminals: 2

Fewer terminals contribute to a simplified design and reduced potential points of failure, enhancing reliability.

Maximum Power Dissipation (Abs): 85 W

An 85 W power dissipation capability ensures the device can manage high power loads, suitable for various power switching applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact circuit designs, ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low output capacitance, providing excellent switching performance.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C allows for reliable operation in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material ensures good thermal conductivity and reliability in high-performance applications.

Terminal Finish: TIN LEAD

Tin lead finish provides excellent solderability and corrosion resistance, ensuring strong and reliable connections.

Maximum Drain Current (ID): 40 A

The ability to handle 40 A drain current provides flexibility for various load applications without sacrificing stability.

Maximum Drain-Source On Resistance: 0.028 ohm

Low on-resistance minimizes power loss, improving overall efficiency and thermal management in power circuits.

Terminal Position: SINGLE

Single terminal position simplifies layout design on PCBs, enhancing manufacturability and reliability.

Case Connection: DRAIN

Direct drain connection simplifies circuit design and improves performance in power applications.

Technical Specifications

Power Field Effect Transistors (FET) STD40NF06T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

250 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD40NF06T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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