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STB76NF80

STMicroelectronics

STB76NF80 by STMicroelectronics

STB76NF80 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features an 80V breakdown voltage, 320A pulsed drain current, and operates at up to 175 °C. Ideal for high-efficiency power management in compact designs.

Median Price

$0.989

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 868 parts In-Stock

1+ parts

$0.989

100+ parts

$0.989

1k+ parts

$0.989

10k+ parts

$0.989

868

$0.989

$0.989

$0.989

$0.989

Chip1Stop

Japan . 868 parts In-Stock

1+ parts

$1.830

100+ parts

-

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868

$1.830

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Verical

USA . 868 parts In-Stock

1+ parts

-

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$0.989

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$0.989

10k+ parts

$0.989

868

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$0.989

$0.989

$0.989

Distributors (In-Stock)

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Digiode

USA . 2,882 parts In-Stock

1+ parts

$0.940

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2,882

$0.940

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Bristol Electronics

USA . 493 parts In-Stock

1+ parts

$5.600

100+ parts

$2.426

1k+ parts

$2.296

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-

493

$5.600

$2.426

$2.296

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Vyrian

USA . 3,914 parts In-Stock

1+ parts

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3,914

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Anansix

USA . 558 parts In-Stock

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558

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Dan-Mar Components

USA . 493 parts In-Stock

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493

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Distributors (Availability)

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Ampacity Inc.

Singapore . 433 parts In-Stock

1+ parts

$0.840

100+ parts

-

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433

$0.840

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Corphita

USA . 2,705 parts In-Stock

1+ parts

$0.890

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2,705

$0.890

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Component Stockers USA

USA . 2,573 parts In-Stock

1+ parts

$1.120

100+ parts

$1.120

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2,573

$1.120

$1.120

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

1+ parts

$1.645

100+ parts

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$1.480

10k+ parts

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1,557

$1.645

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$1.480

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MKK Technologies

India . 409 parts In-Stock

1+ parts

$3.093

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409

$3.093

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DigiPath Technology Company

USA . 409 parts In-Stock

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$3.093

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409

$3.093

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AZTECH Wire

Italy . 1,132 parts In-Stock

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$8.150

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$8.150

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Alle Elektronik GmbH

Germany . 4,160 parts In-Stock

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Perfect Parts

USA . 3,261 parts In-Stock

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3,261

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Parana Technologies

USA . 2,030 parts In-Stock

1+ parts

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$1.967

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2,030

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$1.967

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Kepictronics

USA . 966 parts In-Stock

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966

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Overview

Unlock superior performance with the STB76NF80 from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced N-channel FET excels in switching applications, offering remarkable efficiency and reliability for various power management needs. With its compact design and robust capabilities, it ensures seamless integration into your projects, enhancing durability while maintaining optimal thermal performance. Elevate your designs today with unmatched quality and support from STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

As an N-channel FET, this transistor provides higher efficiency and power handling capabilities, making it ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode enhances circuit protection and simplifies the design, making it a versatile component in power applications.

Transistor Application: SWITCHING

Designed for switching applications, this transistor allows for efficient control of power and signal, making it suitable for modern electronic devices.

Surface Mount: YES

Being surface mount compatible allows for compact designs and easier assembly in printed circuit boards, catering to the demands of modern electronic designs.

Minimum DS Breakdown Voltage: 80 V

The minimum drain-source breakdown voltage of 80 V provides a robust tolerance to high voltages, ensuring reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape maximizes PCB space efficiency, allowing for flexible designs in compact electronic products.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance the mechanical reliability of the connection, making it user-friendly in assembly.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for low power loss and improved performance in switching characteristics, making it suitable for various applications.

Maximum Pulsed Drain Current (IDM): 320 A

With a maximum pulsed drain current of 320 A, this FET can handle high current spikes, making it ideal for heavy-duty applications.

Avalanche Energy Rating (EAS): 700 mJ

A high avalanche energy rating indicates robust performance under voltage transients, contributing to the longevity and reliability of the component.

Maximum Drain Current (Abs) (ID): 80 A

The ability to withstand a maximum drain current of 80 A ensures strong performance in high-load scenarios, enabling its use in power management applications.

No. of Terminals: 2

The simple two-terminal design simplifies the circuit connections and reduces the potential for errors in circuit assembly.

Maximum Power Dissipation (Abs): 300 W

With a maximum power dissipation of 300 W, this FET can effectively manage heat, ensuring reliability and performance in demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving in designs while providing sufficient thermal management capabilities.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using MOS technology enables fast switching speeds and better control over conductivity, enhancing overall circuit performance.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C ensures that this transistor can function reliably in high-temperature environments typically found in power applications.

Transistor Element Material: SILICON

Silicon as the material for the transistor element provides excellent electronic properties, ensuring high efficiency and stability across a wide range of applications.

Maximum Drain Current (ID): 80 A

The consistent maximum drain current rating of 80 A ensures reliable performance under load, making it a suitable choice for high-performance circuitry.

Maximum Drain-Source On Resistance: 0.011 ohm

A low on-resistance of 0.011 ohm reduces power losses during operation, enhancing overall circuit efficiency and thermal management.

Terminal Position: SINGLE

The single terminal position simplifies circuit layout and integration, allowing for easier design and assembly processes.

Case Connection: DRAIN

A direct drain connection enhances thermal performance and reliability, ensuring efficient heat dissipation in power applications.

Technical Specifications

Power Field Effect Transistors (FET) STB76NF80 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB76NF80 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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