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STB75NF75

STMicroelectronics

STB75NF75 by STMicroelectronics

STB75NF75 by STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, breakdown voltage of 75 V, and operates at up to 175 °C. Ideal for high-performance power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,672 parts In-Stock

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1,672

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Digiode

USA . 710 parts In-Stock

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710

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Anansix

USA . 384 parts In-Stock

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384

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,558 parts In-Stock

1+ parts

$1.801

100+ parts

-

1k+ parts

$1.621

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1,558

$1.801

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$1.621

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MKK Technologies

India . 2,196 parts In-Stock

1+ parts

$3.387

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2,196

$3.387

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DigiPath Technology Company

USA . 2,196 parts In-Stock

1+ parts

$3.387

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2,196

$3.387

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RC Electronics

USA . 30,000 parts In-Stock

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30,000

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 6,219 parts In-Stock

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6,219

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Corphita

USA . 4,789 parts In-Stock

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4,789

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Parana Technologies

USA . 2,200 parts In-Stock

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$2.154

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2,200

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$2.154

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Overview

Elevate your power management solutions with the STB75NF75 from STMicroelectronics, a leader in innovation and quality. This N-channel Power FET delivers exceptional performance for demanding applications, ensuring reliability and efficiency in switching tasks. With its robust design and advanced technology, it optimizes energy use while minimizing heat generation. Trust in STMicroelectronics for unparalleled quality and unlock the full potential of your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are often preferred for high-speed and efficient switching applications, providing better performance in enhancing mode.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers additional protection and simplifies circuit design by reducing the need for external components.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast operation, making it ideal for modern circuitry.

Surface Mount: YES

As a surface mount component, it allows for easier integration into compact designs and enhances manufacturing efficiency.

Minimum DS Breakdown Voltage: 75 V

The high breakdown voltage ensures reliable operation in demanding applications, providing added safety margins.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, making it easier to design compact circuit layouts.

Terminal Form: GULL WING

Gull wing terminals facilitate good soldering practices and are compatible with automated assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and better control in digital circuits, making it suited for diverse applications.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed current rating allows this FET to handle transient loads without damage, increasing its versatility.

Avalanche Energy Rating (EAS): 700 mJ

This high avalanche energy rating indicates robustness against overvoltage and transients, improving reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 75 A

A high maximum drain current capacity supports demanding applications, ensuring reliable performance under heavy loads.

No. of Terminals: 2

The simplicity of a two-terminal design reduces complexity in circuitry, optimizing space and layout.

Maximum Power Dissipation (Abs): 300 W

High power dissipation capability ensures that the FET can handle significant loads without overheating, enhancing its reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern electronics, supporting compact designs and space-saving requirements.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making this FET energy-efficient for many applications.

Maximum Operating Temperature: 175 °C

A high operating temperature limit enables the FET to function in extreme environments, ensuring reliability in harsh conditions.

Transistor Element Material: SILICON

Silicon is a widely-used material known for its excellent semiconductor properties, enhancing the performance and stability of the FET.

Terminal Finish: MATTE TIN

A matte tin finish provides good solderability and corrosion resistance, ensuring reliability over time.

Maximum Drain Current (ID): 80 A

With a maximum drain current of 80 A, this FET can handle heavy loads, making it suitable for demanding industrial applications.

Maximum Drain-Source On Resistance: 0.011 ohm

A low on-resistance contributes to higher efficiency by reducing power loss during operation, ideal for energy-sensitive applications.

Terminal Position: SINGLE

A single terminal position enhances layout simplicity and reduces potential connectivity issues in circuit designs.

Case Connection: DRAIN

The case connection to the drain ensures optimal thermal management and performance in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STB75NF75 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB75NF75 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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