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STB60NF10-1

STMicroelectronics

STB60NF10-1 by STMicroelectronics

STB60NF10-1 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 80 A, breakdown voltage of 100 V, and power dissipation up to 300 W. Ideal for high-efficiency circuits, it operates in enhancement mode with built-in diode support.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,530 parts In-Stock

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4,530

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Anansix

USA . 1,718 parts In-Stock

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1,718

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Digiode

USA . 773 parts In-Stock

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773

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IDEA Electronic Components Group

UK . 129 parts In-Stock

1+ parts

$1.714

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$1.543

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129

$1.714

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$1.543

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MKK Technologies

India . 1,917 parts In-Stock

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$3.223

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1,917

$3.223

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DigiPath Technology Company

USA . 1,917 parts In-Stock

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$3.223

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1,917

$3.223

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AZTECH Wire

Italy . 395 parts In-Stock

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$14.570

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395

$14.570

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Kepictronics

USA . 5,330 parts In-Stock

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5,330

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Alle Elektronik GmbH

Germany . 4,887 parts In-Stock

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RC Electronics

USA . 4,500 parts In-Stock

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Corphita

USA . 3,497 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Perfect Parts

USA . 801 parts In-Stock

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801

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Parana Technologies

USA . 172 parts In-Stock

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$2.049

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172

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$2.049

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Overview

Unlock unparalleled efficiency and reliability with the STB60NF10-1 from STMicroelectronics. Renowned for its commitment to innovation, STMicroelectronics delivers a powerful N-channel FET designed for seamless switching applications. With a robust design that withstands extreme conditions, this transistor offers exceptional performance, making it ideal for automotive, industrial, and consumer electronics. Experience superior value and durability—choose STB60NF10-1 for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode simplifies circuit design and improves reliability, providing a robust solution for switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control large currents, making it perfect for power electronics.

Minimum DS Breakdown Voltage: 100 V

A high breakdown voltage rating allows for safe operation in high-voltage environments, increasing versatility in application.

Package Shape: RECTANGULAR

The rectangular package shape optimizes the space on PCB, facilitating easy integration into compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing reliability in various mounting conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient control and switching, making this FET suitable for modern electronic circuits.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capability enhances performance in peak load applications, making it suitable for high-power designs.

Avalanche Energy Rating (EAS): 485 mJ

The substantial avalanche energy rating indicates robustness against voltage spikes, making this FET reliable in challenging environments.

Maximum Drain Current (Abs) (ID): 80 A

A maximum sustained current rating of 80 A ensures the FET can handle significant loads without overheating.

No. of Terminals: 3

Three terminals provide the necessary connections for input, output, and gate control, allowing for straightforward integration.

Maximum Power Dissipation (Abs): 300 W

High power dissipation capability allows for better thermal management and the ability to handle demanding applications.

Package Style (Meter): IN-LINE

The in-line package style simplifies PCB layout, providing ease of handling and assembly in production.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high efficiency and fast switching speeds, making this FET ideal for modern electronic applications.

Maximum Operating Temperature: 175 °C

Operating at high temperatures increases reliability and allows the FET to function effectively in demanding environments.

Transistor Element Material: SILICON

Silicon as the element material is well-established in the industry, providing stability and high performance for power applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability, ensuring reliable connections during assembly.

Maximum Drain Current (ID): 80 A

This maximum drain current maintains consistent performance in high-load applications, ensuring reliability and efficiency.

Maximum Drain-Source On Resistance: 0.023 ohm

Low on-resistance translates to minimal power loss during operation, enhancing overall system efficiency.

Terminal Position: SINGLE

A single terminal position simplifies the design and integration process, allowing for more flexible PCB layout.

Case Connection: DRAIN

The drain connection simplifies the design for high-current applications, ensuring efficient power management.

Technical Specifications

Power Field Effect Transistors (FET) STB60NF10-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

485 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB60NF10-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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