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STB40NF20

STMicroelectronics

STB40NF20 by STMicroelectronics

STB40NF20 by STMicroelectronics is a N-CHANNEL FET with 200V DS Breakdown Voltage and 160A IDM. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 0.045 ohm RDS(on) and 160W Pdiss.

Median Price

$2.294

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 102 parts In-Stock

1+ parts

$2.294

100+ parts

$1.745

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-

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102

$2.294

$1.745

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Mouser Electronics

USA . 1,832 parts In-Stock

1+ parts

$4.200

100+ parts

$2.110

1k+ parts

$1.860

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1,832

$4.200

$2.110

$1.860

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DigiKey

USA . 1,342 parts In-Stock

1+ parts

$4.580

100+ parts

$2.145

1k+ parts

$1.648

10k+ parts

$1.626

1,342

$4.580

$2.145

$1.648

$1.626

Arrow

USA . 17,000 parts In-Stock

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-

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$1.615

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$1.615

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Verical

USA . 17,000 parts In-Stock

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$1.615

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$1.615

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Avnet

USA . 9,000 parts In-Stock

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Digiode

USA . 2,992 parts In-Stock

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$2.179

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$2.179

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Nova Conductors

Japan . 1,000 parts In-Stock

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$2.921

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$2.921

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Freelance Electronics

USA . 135 parts In-Stock

1+ parts

$11.427

100+ parts

$11.998

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$11.313

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135

$11.427

$11.998

$11.313

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Anansix

USA . 2,699 parts In-Stock

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2,699

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IBS Electronics

USA . 2,000 parts In-Stock

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$2.158

10k+ parts

$2.132

2,000

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$2.158

$2.132

Vyrian

USA . 1,318 parts In-Stock

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1,318

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Chip Stock

USA . 975 parts In-Stock

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975

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Cyclops Electronics Ltd

UK . 773 parts In-Stock

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773

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ComSIT Distribution GmbH

Germany . 266 parts In-Stock

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J2 Sourcing AB

Sweden . 45 parts In-Stock

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45

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Distributors (Availability)

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Corohmni

South Africa . 529 parts In-Stock

1+ parts

$0.381

100+ parts

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529

$0.381

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Aztec Data Supply Inc.

USA . 4,855 parts In-Stock

1+ parts

$0.540

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4,855

$0.540

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IDEA Electronic Components Group

UK . 1,141 parts In-Stock

1+ parts

$0.661

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$0.595

10k+ parts

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1,141

$0.661

-

$0.595

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Modulus Dynamics

Lithuania . 22,260 parts In-Stock

1+ parts

$1.035

100+ parts

$1.035

1k+ parts

$1.035

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22,260

$1.035

$1.035

$1.035

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MKK Technologies

India . 886 parts In-Stock

1+ parts

$1.242

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886

$1.242

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DigiPath Technology Company

USA . 886 parts In-Stock

1+ parts

$1.242

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886

$1.242

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

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$1.530

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1,289

$1.530

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Semicontronic

India . 1,113 parts In-Stock

1+ parts

$1.530

100+ parts

$1.492

1k+ parts

$1.484

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1,113

$1.530

$1.492

$1.484

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Corphita

USA . 2,035 parts In-Stock

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$2.065

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2,035

$2.065

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Argo Parts USA

USA . 3,341 parts In-Stock

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$2.921

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3,341

$2.921

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Continental Prestige Electronics

USA . 1,793 parts In-Stock

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$2.921

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$2.863

1,793

$2.921

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$2.863

Netroflash

USA . 100 parts In-Stock

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$2.921

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$2.775

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$2.717

100

$2.921

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$2.775

$2.717

Microchip USA

USA . 5,910 parts In-Stock

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$17.737

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$17.737

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Perfect Parts

USA . 8,392 parts In-Stock

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Lixinc

USA . 7,245 parts In-Stock

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RC Electronics

USA . 6,818 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,647 parts In-Stock

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Kepictronics

USA . 3,433 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 1,338 parts In-Stock

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1,338

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Parana Technologies

USA . 831 parts In-Stock

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$0.790

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831

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$0.790

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iodParts Technologies Inc.

India . 795 parts In-Stock

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795

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Overview

Experience the power of innovation with the STB40NF20 by STMicroelectronics. Crafted with precision and expertise, this Power Field Effect Transistor offers unparalleled performance in switching applications. With a focus on quality and reliability, STMicroelectronics ensures that this N-CHANNEL transistor delivers exceptional results every time. Whether you're looking to enhance your electronics or streamline your systems, the STB40NF20 provides the perfect solution. Trust in STMicroelectronics for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in high power applications and offer better performance compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against reverse polarity, enhancing overall reliability.

Transistor Application: SWITCHING

Designed for switching applications, offering fast switching speeds and efficient power management.

Surface Mount: YES

Surface-mountable design allows for easy installation and saves space on the PCB.

Minimum DS Breakdown Voltage: 200 V

High breakdown voltage ensures reliability and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 160 A

High pulsed drain current rating allows for handling of sudden high current spikes.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capability makes it suitable for high-power applications without overheating.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for use in various environments and conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and performance in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STB40NF20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB40NF20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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