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STB40NF10-1

STMicroelectronics

STB40NF10-1 by STMicroelectronics

STB40NF10-1 from STMicroelectronics is a robust N-channel FET designed for efficient switching applications. It features a max drain current of 50 A, breakdown voltage of 100 V, and power dissipation up to 150 W. Ideal for high-performance power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,746 parts In-Stock

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Vyrian

USA . 963 parts In-Stock

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963

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Anansix

USA . 336 parts In-Stock

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336

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 483 parts In-Stock

1+ parts

$1.736

100+ parts

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$1.562

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483

$1.736

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$1.562

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MKK Technologies

India . 8 parts In-Stock

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$3.265

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8

$3.265

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DigiPath Technology Company

USA . 8 parts In-Stock

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$3.265

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8

$3.265

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Corphita

USA . 3,619 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 2,333 parts In-Stock

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$2.076

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2,333

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$2.076

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Overview

Elevate your designs with the STB40NF10-1 from STMicroelectronics, a powerful N-channel FET crafted for efficiency and reliability. With robust performance in switching applications, its advanced technology ensures superior thermal management and minimal on-resistance. Trust in STMicroelectronics’ industry-leading expertise to deliver unparalleled quality, enhancing your projects across automotive, industrial, and consumer electronics. Experience the perfect blend of power and precision!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

Provides higher efficiency and better switching performance for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and improves protection against voltage spikes.

Transistor Application: SWITCHING

Designed specifically for fast switching applications, enhancing overall circuit efficiency.

Minimum DS Breakdown Voltage: 100 V

Ensures safe operation in high-voltage applications.

Package Shape: RECTANGULAR

Optimizes space usage on circuit boards, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Provides robust connection options, ensuring mechanical stability and ease of soldering.

Operating Mode: ENHANCEMENT MODE

Allows for lower ON resistance and higher efficiency during operation.

Maximum Pulsed Drain Current (IDM): 200 A

Capable of handling high pulse currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 150 mJ

Dissipates energy efficiently, protecting the device from high-energy transients.

Maximum Drain Current (Abs) (ID): 50 A

Supports high current applications, ensuring robust performance under load.

No. of Terminals: 3

Sufficient terminal count for effective device integration in various circuit configurations.

Maximum Power Dissipation (Abs): 150 W

Handles significant power levels, which aids in maintaining thermal stability.

Package Style (Meter): IN-LINE

Facilitates easy integration in automated assembly processes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Enables low power consumption and high-speed operation.

Maximum Operating Temperature: 175 °C

Allows operation in extreme environments, increasing the application scope.

Transistor Element Material: SILICON

Proven material for reliable performance in a variety of electronic applications.

Terminal Finish: MATTE TIN

Provides excellent solderability and corrosion resistance.

Maximum Drain-Source On Resistance: 0.028 ohm

Low on-resistance leads to increased efficiency and reduced heat generation.

Terminal Position: SINGLE

Simplifies layout design, maximizing space efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

Optimized for modern reflow soldering processes, enhancing production efficiency.

Peak Reflow Temperature: 245 °C

Compatible with most soldering technologies, allowing for versatile manufacturing options.

Technical Specifications

Power Field Effect Transistors (FET) STB40NF10-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB40NF10-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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