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STB45N40DM2AG

STMicroelectronics

STB45N40DM2AG by STMicroelectronics

STB45N40DM2AG by STMicroelectronics is a N-CHANNEL FET with 400V DS Breakdown Voltage, 38A ID, and 0.072 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at -55 to 150 °C. AEC-Q101 compliant, it features GULL WING terminals and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$3.910

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,230 parts In-Stock

1+ parts

$7.760

100+ parts

$4.070

1k+ parts

$3.780

10k+ parts

-

1,230

$7.760

$4.070

$3.780

-

DigiKey

USA . 1,216 parts In-Stock

1+ parts

$7.810

100+ parts

$4.066

1k+ parts

$3.322

10k+ parts

-

1,216

$7.810

$4.066

$3.322

-

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.359

10k+ parts

-

2,000

-

-

$3.359

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Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

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$2.735

10k+ parts

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2,000

-

-

$2.735

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Avnet

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

-

-

-

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Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.910

10k+ parts

-

1,000

-

-

$3.910

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.450

100+ parts

-

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-

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100

$4.450

-

-

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Digiode

USA . 1,803 parts In-Stock

1+ parts

$6.346

100+ parts

-

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-

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1,803

$6.346

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-

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IBS Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.862

10k+ parts

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5,000

-

-

$5.862

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Avant Electronics Limited

UK . 983 parts In-Stock

1+ parts

-

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983

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Vyrian

USA . 816 parts In-Stock

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816

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Chip Stock

USA . 446 parts In-Stock

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446

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Anansix

USA . 371 parts In-Stock

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371

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Bristol Electronics

USA . 53 parts In-Stock

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53

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 570 parts In-Stock

1+ parts

$0.597

100+ parts

-

1k+ parts

$0.537

10k+ parts

-

570

$0.597

-

$0.537

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MKK Technologies

India . 1,964 parts In-Stock

1+ parts

$1.123

100+ parts

-

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1,964

$1.123

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DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

$1.123

100+ parts

-

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1,964

$1.123

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Aztec Data Supply Inc.

USA . 74 parts In-Stock

1+ parts

$1.200

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74

$1.200

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Corohmni

South Africa . 344 parts In-Stock

1+ parts

$1.220

100+ parts

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344

$1.220

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Ampacity Inc.

Singapore . 851 parts In-Stock

1+ parts

$3.200

100+ parts

-

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851

$3.200

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Continental Prestige Electronics

USA . 3,644 parts In-Stock

1+ parts

$4.450

100+ parts

-

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10k+ parts

$4.361

3,644

$4.450

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-

$4.361

Argo Parts USA

USA . 2,378 parts In-Stock

1+ parts

$4.450

100+ parts

-

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2,378

$4.450

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$4.450

100+ parts

$4.228

1k+ parts

$4.016

10k+ parts

$3.960

200

$4.450

$4.228

$4.016

$3.960

Corphita

USA . 4,210 parts In-Stock

1+ parts

$6.012

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4,210

$6.012

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iodParts Technologies Inc.

India . 16,000 parts In-Stock

1+ parts

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16,000

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A-Z Elektronik GmbH

Germany . 4,761 parts In-Stock

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4,761

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Parana Technologies

USA . 2,162 parts In-Stock

1+ parts

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100+ parts

$0.714

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2,162

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$0.714

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

1+ parts

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2,000

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Infinite Electronics LLP (Excess)

. 759 parts In-Stock

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759

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Overview

Discover the STB45N40DM2AG by STMicroelectronics, a high-quality Power FET designed for optimal performance in switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers reliability and efficiency. Ideal for a wide range of electronic devices, this FET boasts a maximum pulsing drain current of 110A and a minimum breakdown voltage of 400V, making it a versatile choice for various projects. Trust STMicroelectronics for cutting-edge technology and innovative solutions that deliver unmatched value and benefits to customers seeking superior performance and durability. Choose the STB45N40DM2AG for your next project and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against back EMF, making this product suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Allows for easy and quick installation on circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 400 V

High breakdown voltage provides a margin of safety and reliability in high voltage applications.

Maximum Pulsed Drain Current (IDM): 110 A

Can handle high currents in pulsed applications, making it suitable for demanding scenarios.

Avalanche Energy Rating (EAS): 1100 mJ

High avalanche energy rating indicates the device can withstand high energy pulses without damage, ensuring reliability in harsh conditions.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, making it suitable for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.072 ohm

Low on-resistance leads to less power dissipation and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STB45N40DM2AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

400 V

Maximum Drain Current (ID):

38 A

Maximum Drain-Source On Resistance:

.072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

110 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB45N40DM2AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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