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STB141NF55-1

STMicroelectronics

STB141NF55-1 by STMicroelectronics

STB141NF55-1 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 80 A and a breakdown voltage of 55 V. It operates in enhancement mode with a low on-resistance of just 0.008 Ω. This robust transistor supports high power dissipation up to 300 W, making it suitable for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,534 parts In-Stock

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Digiode

USA . 2,990 parts In-Stock

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2,990

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Anansix

USA . 1,200 parts In-Stock

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1,200

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IDEA Electronic Components Group

UK . 982 parts In-Stock

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$1.044

100+ parts

-

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$0.940

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982

$1.044

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$0.940

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MKK Technologies

India . 756 parts In-Stock

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$1.964

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756

$1.964

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DigiPath Technology Company

USA . 756 parts In-Stock

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$1.964

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756

$1.964

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AZTECH Wire

Italy . 469 parts In-Stock

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$20.120

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469

$20.120

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Alle Elektronik GmbH

Germany . 4,928 parts In-Stock

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4,928

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Corphita

USA . 2,269 parts In-Stock

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Parana Technologies

USA . 1,749 parts In-Stock

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$1.248

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Kepictronics

USA . 295 parts In-Stock

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Overview

Unlock unparalleled performance with the STB141NF55-1 from STMicroelectronics, a leader in innovation and quality. This high-efficiency N-channel power FET delivers exceptional switching capabilities, ideal for demanding applications such as renewable energy systems and industrial automation. Its robust design ensures reliability under extreme conditions, providing ultimate peace of mind. Experience superior value and enhanced operational efficiency that only STMicroelectronics can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and moisture resistance, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and are ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection against reverse polarity, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient operation in fast switching environments.

Minimum DS Breakdown Voltage: 55 V

A minimum breakdown voltage of 55V supports applications requiring higher voltage tolerances without failure.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and assembly, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and easier handling during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better control of the drain current, providing efficient operation in electronic circuits.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed drain current capability makes this FET suitable for demanding applications requiring brief high-current surges.

Avalanche Energy Rating (EAS): 1300 mJ

A high avalanche energy rating ensures the device can withstand transient voltage spikes, leading to improved reliability.

Maximum Drain Current (Abs) (ID): 80 A

An absolute maximum current rating of 80A allows for substantial power handling, promising performance in high-load situations.

No. of Terminals: 3

Three terminals simplify connections while offering flexibility in circuit design for various applications.

Maximum Power Dissipation (Abs): 300 W

The capability to dissipate up to 300W of power supports high-performance designs in demanding environments.

Package Style (Meter): IN-LINE

In-line packaging contributes to compact design and efficient thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers higher efficiency and faster switching, suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

A high operating temperature tolerance ensures reliable performance in extreme conditions.

Transistor Element Material: SILICON

Silicon material provides excellent electrical characteristics and is widely used in electronic components.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes the device suitable for use in harsh environments without performance loss.

Terminal Finish: Matte Tin (Sn)

Matte tin finishes improve solderability and provide corrosion resistance, enhancing product longevity.

Maximum Drain Current (ID): 80 A

Reiterating the 80A rating emphasizes the robust current handling capacity for various high-power applications.

Maximum Drain-Source On Resistance: 0.008 ohm

A low on-resistance minimizes power loss during operation, enhancing efficiency and thermal performance.

Terminal Position: SINGLE

A single terminal position reduces complexity in layout, making integration easier in circuit designs.

Case Connection: DRAIN

Direct drain connection aids in effective heat dissipation, contributing to overall performance stability.

Maximum Feedback Capacitance (Crss): 290 pF

Low feedback capacitance ensures high-speed operation and enhances switching performance.

Technical Specifications

Power Field Effect Transistors (FET) STB141NF55-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

290 pF

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB141NF55-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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